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參數(shù)資料
| 型號(hào)： | UPD75206 |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機(jī) |
| 文件頁數(shù)： | 58/62頁 |
| 文件大?。?/td> | 489K |
| 代理商： | UPD75206 |
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58
μ
PD75206
15. RECOMMEDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions for the surface mounting type, refer to the document
“Semiconductor Device Mount Technology” (IEI-1207)
.
For soldering methods and conditions other than those recommended below, contact our salesman.
Table 15-1 Surface Mounting Type Conditions
Recommended
Condition Symbol
Solderring Method
Solderring Conditions
Solder bath temperature: 260
°
C or less, Duration: 10 sec. max.,
Number of times: Once
Preheating temperature : 120
°
C max. (package surface temperature)
Package peak temperature: 230
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Once
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Once
Pin part temperature: 300
°
C or below , Duration: 3 sec. max. (per device side)
Wave soldering
WS60-00-1
*
For the storage period after dry-pack decompression storage conditions are max. 25
°
C, 65 % RH.
Note Use of more than one soldering method should be avoided (except in the case of pin part heating).
Table 15-2 Insertion Type Soldering Conditions
μ
PD75206CW-
×××
: 64-pin plastic shrink DIP (750 mil)
μ
PD75206GF-
×××
-3BE : 64-pin plastic QFP (body 14
×
20 mm)
Note
Ensure that the application of wave soldering is limited to the lead part and no solder touches the main
unit directly.
Infrared reflow
IR-30-00-1
VPS
VP15-00-1
Pin part heating
–––
Solderring Method
Solderring Conditions
Wave soldering
(lead part only)
Solder bath temperature: 260
°
C or below , Duration: 10 sec. max.
Pin part temperature: 260
°
C or below , Duration: 10 sec. max.
Pin part heating
#
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