- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄379502 > UPD75108A (NEC Corp.) 4-BIT SINGLE-CHIP MICROCOMPUTER PDF資料下載
參數(shù)資料
| 型號： | UPD75108A |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機 |
| 文件頁數(shù)： | 60/66頁 |
| 文件大小： | 460K |
| 代理商： | UPD75108A |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁當前第60頁第61頁第62頁第63頁第64頁第65頁第66頁
μ
PD75104A, 75108A
60
Symbol for Recommended
Condition
Symbol for Recommended
Condition
15. RECOMMENDED SOLDERING CONDITIONS
It is recommended that
μ
PD75104A, 75106A, and 75108A be soldered under the following conditions.
For details on the recommended soldering conditions, refer to Information Document "Semiconductor
Devices Mounting Manual" (IEI-616).
For other soldering methods and conditions, please consult NEC.
Table 15-1 Soldering Conditions of Surface Mount Type
(1)
μ
PD75108AGC - xxx - AB8: 64-pin plastic QFP ( 14 mm)
Soldering Method
Soldering Conditions
Infrared Reflow
Package peak temperature: 230
°
C, time: 30 seconds max.
(210
°
C min.), number of times: 1
Package peak temperature: 215
°
C, time: 40 seconds max.
(200
°
C min.), number of times: 1
Soldering bath temperature: 260
°
C max., time: 10 seconds
max., number of times: 1,
pre-heating temperature: 120
°
C max. (package surface
temperature)
Pin temperature: 300
°
C max.,
time: 3 seconds max. (per side)
IR30-00-1
VPS
VP15-00-1
Wave Soldering
WS60-00-1
Pin Partial Heating
—
(2)
μ
PD75104AGC - xxx - AB8: 64-pin plastic QFP ( 14 mm)
Soldering Method
Soldering Conditions
Infrared Reflow
Package peak temperature: 230
°
C, time: 30 seconds max.
(210
°
C min.), number of times: 1, number of days: 2 days
*
,
(afterwards, 16 hours of prebaking at 125
°
C is required.)
Package peak temperature: 215
°
C, time: 40 seconds max.
(200
°
C min.), number of times: 1, number of days: 2 days
*
,
(afterwards, 16 hours of prebaking at 125
°
C is required.)
Soldering bath temperature: 260
°
C max., time: 10 seconds
max., number of times: 1, pre-heating temperature: 120
°
C
max. (package surface temperature), number of days:
2 days
*
, (afterwards, 16 hours of prebaking at 125
°
C is
required.)
Pin temperature: 300
°
C max.,
time: 3 seconds max. (per side)
IR30-162-1
VPS
VP15-162-1
Wave Soldering
WS60-162-1
Pin Partial Heating
—
*:
This means the number of days after unpacking the dry pack. Storage conditions are 25
°
C and 65% RH max.
Caution: Do not use two or more soldering methods in combination (except the pin partial heating method).
Notice
A model that can be soldered under the more stringent conditions (infrared reflow peak temperature:
235
°
C, number of times: 2, and an extended number of days) is also available.
For details, consult NEC.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPD75108AGC | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| UPD75104 | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| UPD75104CW | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| UPD75104GF | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| UPD75106 | 4-BIT SINGLE-CHIP MICROCOMPUTER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD75208 | 制造商:Panasonic Industrial Company 功能描述:IC |
| UPD753012AGC-P33-8BT-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD753016AGC-P29-8BT | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD75304GF-407-3B9 | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD75306G182 | 制造商:Panasonic Industrial Company 功能描述:IC |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。