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參數(shù)資料
| 型號： | uPD750068GT |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | 4位單晶片微控制器 |
| 文件頁數(shù)： | 72/82頁 |
| 文件大小： | 460K |
| 代理商： | UPD750068GT |
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μ
PD750064, 750066, 750068, 750064(A), 750066(A), 750068(A)
72
Data Sheet U10165EJ2V0DS00
15. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD750068 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 15-1. Surface Mounting Type Soldering Conditions
μ
PD750064GT-
×××
μ
PD750066GT-
×××
μ
PD750068GT-
×××
μ
PD750064GT(A)-
×××
: 42-pin plastic shrink SOP (375 mil, 0.8-mm pitch)
μ
PD750066GT(A)-
×××
: 42-pin plastic shrink SOP (375 mil, 0.8-mm pitch)
μ
PD750068GT(A)-
×××
: 42-pin plastic shrink SOP (375 mil, 0.8-mm pitch)
: 42-pin plastic shrink SOP (375 mil, 0.8-mm pitch)
: 42-pin plastic shrink SOP (375 mil, 0.8-mm pitch)
: 42-pin plastic shrink SOP (375 mil, 0.8-mm pitch)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235C, Time: 30 sec. Max. (at 210C or higher), IR35-00-2
Count: two times or less
VPS
Package peak temperature: 215C, Time: 40 sec. Max. (at 200C or higher), VP15-00-2
Count: two times or less
Wave soldering
Solder bath temperature: 260C Max., Time: 10 sec. Max.,
Count: once
Preheating temperature: 120C Max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300C Max., Time: 3 sec. Max. (per pin row)
—
Caution
Do not use different soldering methods together (except for partial heating).
Table 15-2. Through Hole Type Soldering Conditions
μ
PD750064CU-
×××
μ
PD750066CU-
×××
μ
PD750068CU-
×××
μ
PD750064CU(A)-
×××
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
μ
PD750066CU(A)-
×××
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
μ
PD750068CU(A)-
×××
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)
Soldering Method
Soldering Conditions
Wave soldering (pin only)
Solder bath temperature: 260C Max., Time: 10 sec. Max.
Partial heating
Pin temperature: 300C Max., Time: 3 sec. Max. (per pin)
Caution
In wave soldering, apply solder only to the pins. Care must be taken that
jet solder does not come in contact with the main body of the package.
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