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參數資料
| 型號： | UPD72001C |
| 廠商： | NEC Corp. |
| 英文描述： | MULTI-PROTOCOL SERIAL CONTROLLERS |
| 中文描述： | 多協(xié)議串行控制器 |
| 文件頁數： | 36/40頁 |
| 文件大?。?/td> | 206K |
| 代理商： | UPD72001C |
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μ
PD72001-11, 72001-A8
36
5. RECOMMENDED SOLDERING CONDITIONS
It is recommended to solder this product under the following conditions.
For details on the recommended soldering conditions, refer to Information Document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended, consult NEC.
Surface mount type
μ
PD72001G-11-22 : 44-pin plastic QFP (10
×
10 mm)
μ
PD72001G-A8-22: 44-pin plastic QFP (10
×
10 mm)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds MAX.
(210
°
C MIN.), Number of times: 2 MAX., Number of days: 7
Note
(After that, prebaking for 10 hours at 125
°
C is necessary.)
<Precaution>
Products other than in heat-resistance trays (such as those packaged
in a magazine, taping, or non-heat-resistance tray) cannot be baked
while they are in their package.
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds MAX.
(200
°
C MIN.), Number of times: 2 MAX., Number of days: 7
Note
(After that, prebaking for 10 hours at 125
°
C is necessary.)
<Precaution>
Products other than in heat-resistance trays (such as those packaged
in a magazine, taping, or non-heat-resistance tray) cannot be baked
while they are in their package.
VP15-107-2
Wave soldering
Solder bath temperature: 260
°
C MAX., Time: 10 seconds MAX.,
Number of times: 1, Preheating temperature: 120
°
C MAX.
(package surface temperature), Number of days: 7
Note
(After that, prebaking for 10 hours at 125
°
C is necessary.)
<Precaution>
Products other than in heat-resistance trays (such as those packaged
in a magazine, taping, or non-heat-resistance tray) cannot be baked
while they are in their package.
WS60-107-1
Partial heating
Pin temperature: 300
°
C MAX., Time: 3 seconds MAX.
(per side of device)
—
Note
The number of days the product can be stored at 25
°
C, 65 % RH MAX. after the dry pack has been opened.
Caution Do not use two or more soldering methods in combination (except partial heating).
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| UPD72001-11 | MULTI-PROTOCOL SERIAL CONTROLLERS |
| UPD72001-A8 | MULTI-PROTOCOL SERIAL CONTROLLERS |
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| UPD720101F1-EA8-A | 功能描述:HOST CTLR USB 2.0 144-FBGA RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標準包裝:2,450 系列:- 控制器類型:SPI 總線至 I²C 總線橋接 接口:I²C，串行，SPI 電源電壓:2.4 V ~ 3.6 V 電流 - 電源:11mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應商設備封裝:24-HVQFN（4x4） 包裝:托盤 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名稱:935286452157SC18IS600IBSSC18IS600IBS-ND |
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