參數(shù)資料
型號： UPD720012
廠商： NEC Corp.
英文描述： HUB CONTROLLER FOR UNIVERSAL SERIAL BUS
中文描述： 集線器控制器通用串行總線
文件頁數(shù)： 34/36頁
文件大?。?/td> 414K
代理商： UPD720012
34
Data Sheet S13918EJ3V0DS
μ
PD72012
5. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD72012 should be soldered and mounted under the following recommended conditions. For the details of
the recommended soldering conditions, refer to the document
Semiconductor Device Mounting Technology
Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Surface mount type soldering conditions
μ
PD72012GB-XXX-3B4: 44-pin plastic QFP (10
×
10)
Soldering Method
Soldering Conditions
Recommended
Condition Code
Infrared reflow
Peak package temperature: 235
°
C, Time: 30 sec. max. (210
°
C min.), Count: three
times or less
IR35-00-3
VPS
Peak package temperature: 215
°
C, Time: 40 sec. max. (200
°
C min.), Count: three
times or less
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 sec. max., Count: once,
Preheating temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Pin partial heating
Pin temperature: 300
°
C max., Time: 3 sec. max. (per device side)
–
Caution
Avoid using different soldering methods together. (However, the pin partial heating method is
excluded.)
Through-hole type soldering conditions
μ
PD72012CU-XXX: 42-pin plastic SDIP (15.24 mm (600))
Soldering Method
Soldering Conditions
Wave soldering (pins
only)
Solder bath temperature: 260
°
C max., Time: 10 sec. max.
Pin partial heating
Pin temperature: 300
°
C max., Time: 3 sec. max. (per pin)
Caution
Apply wave soldering only to the pins, and exercise care that solder does not directly contact
the package.
相關(guān)PDF資料
PDF描述
UPD72012CU HUB CONTROLLER FOR UNIVERSAL SERIAL BUS
UPD72012GB HUB CONTROLLER FOR UNIVERSAL SERIAL BUS
UPD72012CU-XXX HUB CONTROLLER FOR UNIVERSAL SERIAL BUS
UPD72012GB-XXX HUB CONTROLLER FOR UNIVERSAL SERIAL BUS
UPD72012GB-XXX-3B4 HUB CONTROLLER FOR UNIVERSAL SERIAL BUS
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