參數(shù)資料
型號： UPD70F3033AYGC-8EU
廠商： NEC Corp.
元件分類： 圓形連接器
英文描述： Circular Connector; MIL SPEC:MIL-C-5015 E/F/R; Body Material:Aluminum Alloy; Series:MS3106; No. of Contacts:3; Connector Shell Size:10SL; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Gender:Female RoHS Compliant: No
中文描述： V850/SB1TM 32-/16-BIT單晶片微控制器
文件頁數(shù)： 50/56頁
文件大?。?/td> 357K
代理商： UPD70F3033AYGC-8EU
Data Sheet U14734EJ1V0DS00
50
μ
PD703031A, 703031AY, 703033A, 703033AY, 70F3033A, 70F3033AY
6. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD703031A, 703031AY, 703033A, 703033AY, 70F3033A, and 70F3033AY should be soldered and mounted
under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 6-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD703031AGC-
μ
PD703031AYGC-
μ
PD703033AGC-
μ
PD703033AYGC-
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 10 hours)
VP15-107-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
(2)
μ
PD70F3033AGC-8EU:
μ
PD70F3033AYGC-8EU:
100-pin plastic LQFP (fine pitch) (14
×
14)
100-pin plastic LQFP (fine pitch) (14
×
14)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125°C for 10 hours)
IR35-103-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125°C for 10 hours)
VP15-103-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
相關(guān)PDF資料
PDF描述
UPD703031AYGF V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS
UPD703033AYGF V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS
UPD70F3033AYGF-3BA V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS
UPD70F3035AGF-3BA LJT 56C 48#20 8#16 SKT PLUG
UPD70F3035A V850/SB2TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UPD70F3033AYGC-8EU-A 制造商:Renesas Electronics Corporation 功能描述:
UPD70F3033AYGF-3BA 制造商:NEC 制造商全稱:NEC 功能描述:V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS
UPD70F3033AYGF-3BA-A 制造商:Renesas Electronics Corporation 功能描述:
UPD70F3033AYGF-8EU 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microcontroller
UPD70F3033B 制造商:未知廠家 制造商全稱:未知廠家 功能描述:V850/SB1(TM).V850/SB2(TM) for Hardware | UM Including Electrical Characteristics[02/2003]
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