- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄379500 > UPD70320GJ-5BG (NEC Corp.) V25TM 16/8-BIT SINGLE-CHIP MICROCONTROLLER PDF資料下載
參數(shù)資料
| 型號： | UPD70320GJ-5BG |
| 廠商： | NEC Corp. |
| 英文描述： | V25TM 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| 中文描述： | V25TM 16/8-BIT單片機 |
| 文件頁數(shù)： | 71/74頁 |
| 文件大?。?/td> | 439K |
| 代理商： | UPD70320GJ-5BG |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁當前第71頁第72頁第73頁第74頁
71
μ
PD70320
6. RECOMMENDED SOLDERING CONDITIONS
The following conditions must be met when soldering this product.
For more details, refer to our document
“SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E)
.
Please consult with our sales office when using other soldering process or under different soldering conditions.
Table 6-1. Surface Mount Type Soldering Conditions
(1)
μ
PD70320L
μ
PD70320L-8 : 84-pin plastic QFJ (1150
×
1150 mils)
: 84-pin plastic QFJ (1150
×
1150 mils)
Soldering Process
Soldering Conditions
Symbol
VPS
Package peak temperature: 215
°
C, Reflow time: 40 seconds or less,
Number of reflow processes: 1
Exposure limit: 2 days
Note
(16 hours pre-baking is required at 125
°
C afterwards)
VP15-162-1
Partial heating
method
Pin temperature: 300
°
C or below,
Flow time: 3 seconds or less (per side of device)
—
Note
Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25
°
C and relative
humidity at 65% or less.
(2)
μ
PD70320GJ-5BG
μ
PD70320GJ-8-5BG : 94-pin plastic QFP (20
×
20 mm)
: 94-pin plastic QFP (20
×
20 mm)
Soldering Process
Soldering Conditions
Symbol
Infrared ray reflow
Package peak temperature: 235
°
C, Reflow time: 30 seconds or less,
Number of reflow processes: 3 or less
Exposure limit: 7 days
Note
(36 hours pre-baking is required at 125
°
C afterwards)
IR35-367-3
VPS
Package peak temperature: 215
°
C, Reflow time: 40 seconds or less,
Number of reflow processes: 3 or less
Exposure limit: 7 days
Note
(36 hours pre-baking is required at 125
°
C afterwards)
VP15-367-3
Wave soldering
Package peak temperature: 260
°
C, Reflow time: 10 seconds or less,
Number of reflow processes: 1
Pre-heating temperature: 120
°
C max. (package surface temperature)
Exposure limit: 7 days
Note
(36 hours pre-baking is required at 125
°
C afterwards)
WS60-367-1
Partial heating
method
Pin temperature: 300
°
C or below,
Flow time: 3 seconds or less (per side of device)
—
Note
Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25
°
C and relative
humidity at 65% or less.
Caution
Use of more than one soldering process should be avoided (except for partial heating method).
相關PDF資料 |
PDF描述 |
|---|---|
| UPD70320GJ-8-5BG | V25TM 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD70320 | V25TM 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD70320L-8 | V25TM 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD703210 | 32-Bit Single-Chip Microcontrollers |
| UPD703208 | 32-Bit Single-Chip Microcontrollers |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UPD70320GJ-8 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:16-Bit Microcontroller |
| UPD70320GJ-8-5BG | 制造商:NEC 制造商全稱:NEC 功能描述:V25TM 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD70320GJA-5BG | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:16-Bit Microcontroller |
| UPD70320GJA-8-5BG | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:16-Bit Microcontroller |
| UPD70320L | 制造商:NEC 制造商全稱:NEC 功能描述:V25TM 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
發(fā)布緊急采購，3分鐘左右您將得到回復。