參數(shù)資料
型號(hào): UPD703033AYGF
廠商: NEC Corp.
英文描述: V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS
中文描述: V850/SB1TM 32-/16-BIT單晶片微控制器
文件頁(yè)數(shù): 50/56頁(yè)
文件大?。?/td> 357K
代理商: UPD703033AYGF
Data Sheet U14734EJ1V0DS00
50
μ
PD703031A, 703031AY, 703033A, 703033AY, 70F3033A, 70F3033AY
6. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD703031A, 703031AY, 703033A, 703033AY, 70F3033A, and 70F3033AY should be soldered and mounted
under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 6-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
μ
PD703031AGC-
μ
PD703031AYGC-
μ
PD703033AGC-
μ
PD703033AYGC-
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine pitch) (14
×
14)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 10 hours)
VP15-107-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
(2)
μ
PD70F3033AGC-8EU:
μ
PD70F3033AYGC-8EU:
100-pin plastic LQFP (fine pitch) (14
×
14)
100-pin plastic LQFP (fine pitch) (14
×
14)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125°C for 10 hours)
IR35-103-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125°C for 10 hours)
VP15-103-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
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