- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄378744 > UPD703031AGF (NEC Corp.) V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS PDF資料下載
參數(shù)資料
| 型號： | UPD703031AGF |
| 廠商： | NEC Corp. |
| 英文描述： | V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | V850/SB1TM 32-/16-BIT單晶片微控制器 |
| 文件頁數(shù)： | 51/56頁 |
| 文件大?。?/td> | 357K |
| 代理商： | UPD703031AGF |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁當(dāng)前第51頁第52頁第53頁第54頁第55頁第56頁
Data Sheet U14734EJ1V0DS00
51
μ
PD703031A, 703031AY, 703033A, 703033AY, 70F3033A, 70F3033AY
Table 6-1. Surface Mounting Type Soldering Conditions (2/2)
(3)
μ
PD703031AGF-
μ
PD703031AYGF-
μ
PD703033AGF-
×××
μ
PD703033AYGF-
μ
PD70F3033AGF-3BA:
μ
PD70F3033AYGF-3BA:
×××
-3BA:
×××
-3BA: 100-pin plastic QFP (14
×
20)
-3BA:
100-pin plastic QFP (14
×
20)
×××
-3BA: 100-pin plastic QFP (14
×
20)
100-pin plastic QFP (14
×
20)
100-pin plastic QFP (14
×
20)
100-pin plastic QFP (14
×
20)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 20 hours)
IR35-207-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 20 hours)
VP15-207-2
Wave soldering
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: once
Preheating temperature: 120°C max. (package surface temperature)
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 20 hours)
WS60-207-1
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPD703031AY | V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD703033A | V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD703033AGC | V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD703033AGF | V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD703033AY | V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD703031AY | 制造商:NEC 制造商全稱:NEC 功能描述:V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD703031AYGC | 制造商:NEC 制造商全稱:NEC 功能描述:V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD703031AYGF | 制造商:NEC 制造商全稱:NEC 功能描述:V850/SB1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD703031B | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:V850/SB1(TM).V850/SB2(TM) for Hardware | UM Including Electrical Characteristics[02/2003] |
| UPD703031BY | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:V850 Series Pamphlet | Pamphlet[02/2002] |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。