參數(shù)資料
型號： UPD703015A
廠商： NEC Corp.
英文描述： V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER
中文描述： V850/SA1TM 32-/16-BIT單片機
文件頁數(shù)： 44/48頁
文件大小： 309K
代理商： UPD703015A
Data Sheet U14526EJ2V0DS00
44
μ
PD703014A, 703014AY, 703015A, 703015AY, 703017A, 703017AY
4. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD703014A, 703014AY, 703015A, 703015AY, 703017A, and 703017AY should be soldered and mounted
under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 4-1. Surface Mounting Type Soldering Conditions
(1)
μ
PD703014AGC-
μ
PD703014AYGC-
μ
PD703015AGC-
μ
PD703015AYGC-
μ
PD703017AGC-
μ
PD703017AYGC-
×××
-8EU: 100-pin plastic LQFP (fine-pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine-pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine-pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine-pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine-pitch) (14
×
14)
×××
-8EU: 100-pin plastic LQFP (fine-pitch) (14
×
14)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 10 hours)
VP15-107-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
(2)
μ
PD703014AF1-
×××
μ
PD703014AYF1-
×××
μ
PD703015AF1-
μ
PD703015AYF1-
×××
μ
PD703017AF1-
×××
μ
PD703017AYF1-
-EA6: 121-pin plastic FBGA (12
×
12)
-EA6: 121-pin plastic FBGA (12
×
12)
×××
-EA6: 121-pin plastic FBGA (12
×
12)
-EA6: 121-pin plastic FBGA (12
×
12)
-EA6: 121-pin plastic FBGA (12
×
12)
×××
-EA6: 121-pin plastic FBGA (12
×
12)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 10 hours)
IR35-107-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
相關(guān)PDF資料
PDF描述
UPD703015AY V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER
UPD703014AYF1 V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER
UPD703015AYF1 V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER
UPD703100A-33 V850E/MS1TM 32/16-BIT SINGLE-CHIP MICROCONTROLLERS
UPD703100AGJ-33-8EU Circular Connector; No. of Contacts:43; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:25-43 RoHS Compliant: No
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UPD703015AF1 制造商:NEC 制造商全稱:NEC 功能描述:V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER
UPD703015AF1-XXX-EA6 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROCONTROLLER|32-BIT|V850 CPU|CMOS|BGA|121PIN|PLASTIC
UPD703015AGC 制造商:NEC 制造商全稱:NEC 功能描述:V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER
UPD703015AY 制造商:NEC 制造商全稱:NEC 功能描述:V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER
UPD703015AYF1 制造商:NEC 制造商全稱:NEC 功能描述:V850/SA1TM 32-/16-BIT SINGLE-CHIP MICROCONTROLLER
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