參數(shù)資料
型號(hào)： UPD703003
廠商： NEC Corp.
英文描述： V853TM 32/16-BIT SINGLE-CHIP MICROCONTROLLER
中文描述： V853TM 32/16位單片機(jī)
文件頁(yè)數(shù)： 78/82頁(yè)
文件大?。?/td> 452K
代理商： UPD703003
μ
PD703003
78
Data Sheet U12261EJ2V1DS00
18. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD703003 should be soldered and mounted under the following recommended conditions.
For the recommended soldering conditions, refer to the document
Semiconductor Device Mounting Technology
Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales represen-
tative.
Table 18-1. Soldering Conditions
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
IR35-107-2
VPS
VP15-107-2
Partial heating
—
Note
Exposure limit after dry-pack is opened. Storage conditions: temperature of 25
°
C and relative humidity
of 65% or less.
Caution
Do not use different soldering methods together (except for partial heating).
Package peak temperature: 235
°
C, Reflow time: 30 seconds or
below (210
°
C or higher), Number of reflow processes: 2 max.,
Exposure limit: 7 days
Note
(after that, prebaking is necessary at
125
°
C for 10 hours)
Package peak temperature: 215
°
C, Reflow time: 40 seconds or
below (200
°
C or higher), Number of reflow processes: 2 max.,
Exposure limit: 7 days
Note
(after that, prebaking is necessary at
125
°
C for 10 hours)
Pin temperature: 300
°
C or below, Time: 3 seconds or below
(per side of device)
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