參數(shù)資料
型號(hào): UPD6P5
廠商: NEC Corp.
英文描述: 4-BIT SINGLE-CHIP MICROCONTROLLER FOR INFRARED REMOTE CONTROL TRANSMISSION
中文描述: 4位單片機(jī)的紅外遙控傳輸
文件頁(yè)數(shù): 24/32頁(yè)
文件大?。?/td> 232K
代理商: UPD6P5
24
μ
PD6P5
Data Sheet U14760EJ1V0DS00
8. RECOMMENDED SOLDERING CONDITIONS
Carry out the soldered packaging of this product under the following recommended conditions.
For details of the soldering conditions, refer to information material
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than the recommended conditions, please consult one of our NEC
sales representatives.
Table 8-1. Soldering Conditions for Surface-Mount Type
μ
PD6P5MC-5A4: 20-pin plastic SSOP (7.62 mm (300))
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 sec. Max. (at 210
°
C or higher),
Count: three times or less
IR35-00-3
VPS
Package peak temperature: 215
°
C, Time: 40 sec. Max. (at 200
°
C or higher),
VP15-00-3
Count: three times or less
Wave soldering
Solder bath temperature: 260
°
C Max., Time: 10 sec. Max., Count: once,
Preheating temperature: 120
°
C Max. (package surface temperature)
Pin temperature: 300
°
C Max., Time: 3 sec. Max. (per pin row)
WS60-00-1
Partial heating
Caution Do not use different soldering methods together (except for partial heating).
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