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參數(shù)資料
| 型號(hào)： | UPD6122G-001 |
| 廠商： | NEC Corp. |
| 英文描述： | REMOTE CONTROL TRANSMISSION CMOS IC |
| 中文描述： | 遙控傳輸CMOS集成電路 |
| 文件頁(yè)數(shù)： | 23/28頁(yè) |
| 文件大?。?/td> | 170K |
| 代理商： | UPD6122G-001 |
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μ
PD6121, 6122
23
11. RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
For more details, refer to the NEC document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL (IEI-1207)
.
Please consult an NEC sales representative in case an other soldering process is used, or in case soldering
is done under different conditions.
Table 11-1. Soldering Conditions for Surface Mounting
μ
PD6121G-001: 20-pin plastic SOP (375 mil)
μ
PD6121G-002: 20-pin plastic SOP (375 mil)
μ
PD6122G-001: 24-pin plastic SOP (375 mil)
μ
PD6122G-002: 24-pin plastic SOP (375 mil)
Soldering Process
Soldering Conditions
Symbol
Infrared ray reflow
Peak temperature of package surface: 230
°
C,
Reflow time: 30 seconds or less (210
°
C or higher),
Number of reflow processes: 1
IR30-00-1
VPS
Peak temperature of package surface: 215
°
C,
Reflow time: 40 seconds or less (200
°
C or higher),
Number of reflow processes: 1
VP15-00-1
Wave soldering
Solder temperature: 260
°
C or lower,
Reflow time: 10 seconds or less, Number of reflow processes: 1
Preheat temperature: 120
°
C or lower (at package surface)
WS60-00-1
Partial heating
Pin temperature: 300
°
C or lower,
Time: 3 seconds or less (per device side)
—
Caution
Do not apply more than one soldering method at any one time, except for the partial heating
method.
*
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