參數(shù)資料
型號(hào): UPD4726
廠商: NEC Corp.
元件分類: 外設(shè)及接口
英文描述: Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C
中文描述: 電可擦除可編程邏輯器件
文件頁(yè)數(shù): 11/12頁(yè)
文件大?。?/td> 88K
代理商: UPD4726
11
μ
PD4726
RECOMMENDED SOLDERING CONDITIONS
Solder and mount the
μ
PD4726 under the following recommended conditions.
Consult NEC for conditions other than those recommended.
μ
PD4726GS-BAF
Soldering method
Soldering conditions
Symbol
Infrared ray reflow
Peak temperature of package surface: 235
°
C,
Reflow time: Within 30 sec (210
°
C or higher),
Number of reflow process: 2, Exposure limit: None
Note
IR35-00-2
VPS
Peak temperature of package surface: 215
°
C,
Reflow time: Within 40 sec (200
°
C or higher),
Number of reflow process: 2, Exposure limit: None
Note
VP15-00-2
Wave soldering
Solder temperature: 260
°
C or lower, Reflow time: Within 10 sec,
Number of reflow process: 1, Exposure limit: None
Note
WS60-00-1
Partial heating
Pin temperature: 300
°
C or lower, Time: Within 10 sec,
Exposure limit: None
Note
Note
Exposure limit before soldering after dry-package is opened. Storage condition: 25
°
C and relative humidity
at 65 % or less.
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
REFERENCE
Document name
Document No.
Semiconductor Device Mounting Technology Manual
IEI-1207
Quality grade on NEC Semiconductor Devices
IEI-1209
NEC Semiconductor Device Reliability/Quality Control system
IEI-1212
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