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參數(shù)資料
| 型號： | UPD31172 |
| 廠商： | NEC Corp. |
| 英文描述： | VRC4172TM COMPANION CHIP FOR VR4121TM |
| 中文描述： | VRC4172TM伴侶芯片VR4121TM |
| 文件頁數(shù)： | 39/44頁 |
| 文件大小： | 278K |
| 代理商： | UPD31172 |
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Data Sheet U14388EJ2V0DS00
39
μ
PD31172
4. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD31172 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 4-1. Surface Mounting Type Soldering Conditions
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Three times or less, Exposure limit: 7 days
10 to 72 hours)
Note
(after that, prebake at 125°C for
IR35-107-3
VPS
Package peak temperature: 215°C, Time: 25 to 40 seconds (at 200°C or higher),
Count: Three times or less, Exposure limit: 7 days
10 to 72 hours)
Note
(after that, prebake at 125°C for
VP15-107-3
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
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相關代理商/技術參數(shù) |
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| UPD31172F1-48-FN | 制造商:NEC 制造商全稱:NEC 功能描述:VRC4172TM COMPANION CHIP FOR VR4121TM |
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