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參數(shù)資料
| 型號(hào)： | UPD178F098GF-3BA |
| 廠商： | NEC Corp. |
| 元件分類(lèi)： | 8位微控制器 |
| 英文描述： | 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash |
| 中文描述： | 8位微控制器與2/4/8K字節(jié)在系統(tǒng)可編程閃存 |
| 文件頁(yè)數(shù)： | 8/52頁(yè) |
| 文件大?。?/td> | 247K |
| 代理商： | UPD178F098GF-3BA |
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μ
PD178F098
8
Data Sheet U12920EJ1V0DS00
CONTENTS
1.
DIFFERENCES BETWEEN
μ
PD178F098 AND MASK ROM MODELS ..................................... 9
2.
PIN FUNCTION LIST...................................................................................................................... 10
2.1 Port Pins .................................................................................................................................. 10
2.2 Pins Other Than Port Pins ......................................................................................................11
2.3 I/O Circuits of Pins and Recommended Connections of Unused Pins ............................. 13
3.
MEMORY SIZE SELECT REGISTER (IMS)................................................................................. 17
4.
INTERNAL EXTENSION RAM SIZE SELECT REGISTER (IXS) .............................................. 18
5.
INTERRUPT FUNCTION ................................................................................................................. 19
6.
FLASH MEMORY PROGRAMMING .............................................................................................. 23
6.1 Selecting Communication Mode ........................................................................................... 23
6.2 Flash Memory Programming Function ................................................................................. 24
6.3 Connecting Flashpro III .......................................................................................................... 25
7.
ELECTRICAL SPECIFICATIONS ................................................................................................... 26
8.
PACKAGE DRAWING ..................................................................................................................... 44
9.
RECOMMENDED SOLDERING CONDITIONS ............................................................................. 45
APPENDIX A. DEVELOPMENT TOOLS ............................................................................................... 46
APPENDIX B. RELATED DOCUMENTS .............................................................................................. 48
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