參數(shù)資料
型號(hào): UPD178076GF-XXX-3BA
廠商: NEC Corp.
元件分類(lèi): 8位微控制器
英文描述: 8-BIT MICROCONTROLLER
中文描述: 8位微控制器
文件頁(yè)數(shù): 64/72頁(yè)
文件大?。?/td> 366K
代理商: UPD178076GF-XXX-3BA
64
μ
PD178076,178078,178096,178098
Data Sheet U12885EJ3V0DS00
10. RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended, consult NEC.
Table 10-1. Soldering Conditions for Surface-Mount Type
μ
PD178076GF-XXX-3BA: 100-pin plastic QFP (14
×
20)
μ
PD178078GF-XXX-3BA: 100-pin plastic QFP (14
×
20)
μ
PD178096GF-XXX-3BA: 100-pin plastic QFP (14
×
20)
μ
PD178098GF-XXX-3BA: 100-pin plastic QFP (14
×
20)
Soldering Method
Soldering Conditions
Recommended
Conditions Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 sec max. (210
°
C min.),
Number of times: 3 max.
IR35-00-3
VPS
Package peak temperature: 215
°
C, Time: 40 sec max. (200
°
C min.),
Number of times: 3 max.
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 sec max.,
Number of times: 1, Preheating temperature: 120
°
C max.,
(Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 sec max (per device side)
Caution Do not use two or more soldering methods in combination (except partial heating).
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