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參數(shù)資料
| 型號： | UPD178003GC-XXX-3B9 |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-BIT MICROCONTROLLER |
| 中文描述： | 8位微控制器 |
| 文件頁數(shù)： | 39/48頁 |
| 文件大?。?/td> | 334K |
| 代理商： | UPD178003GC-XXX-3B9 |
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39
μ
PD178002, 178003
Data Sheet U12628EJ3V0DS00
12. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD178002 and 178003 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales represen-
tative.
Table 12-1. Surface Mounting Type Soldering Conditions
μ
PD178002GC-
×××
-3B9:
μ
PD178003GC-
×××
-3B9:
80-pin plastic QFP (14
×
14 mm, 0.65 mm pitch)
80-pin plastic QFP (14
×
14 mm, 0.65 mm pitch)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
IR35-00-3
VPS
VP15-00-3
Wave soldering
WS60-00-1
Partial heating
—
Caution Do not use different soldering methods together (except for partial heating).
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Three times or less
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Three times or less
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: once,
Preheating temperature: 120
°
C max. (package surface temperature)
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
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相關代理商/技術(shù)參數(shù) |
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|---|---|
| UPD178004 | 制造商:NEC 制造商全稱:NEC 功能描述:8-BIT SINGLE-CHIP MICROCONTROLLER |
| UPD178004A | 制造商:NEC 制造商全稱:NEC 功能描述:8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD178004AGC | 制造商:NEC 制造商全稱:NEC 功能描述:8-BIT SINGLE-CHIP MICROCONTROLLERS |
| UPD178004AGC-XXX-3B9 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:8-Bit Microcontroller |
| UPD178004GC | 制造商:NEC 制造商全稱:NEC 功能描述:8-BIT SINGLE-CHIP MICROCONTROLLER |
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