
μ
PD17225, 17226, 17227, 17228
75
Data Sheet  U12643EJ2V0DS00
16. RECOMMENDED SOLDERING CONDITIONS
For the 
μ
PD17225 soldering must be performed under the following conditions.
For details of recommended conditions for surface mounting, refer to information document 
"Semiconductor
Device Mounting Technology Manual"  (C10535E)
.
For other soldering methods, please consult with NEC personnel.
Table 16-1.  Soldering Conditions of Surface Mount Type
(1)
 μ
PD17225GT-
×××
: 28-pin plastic SOP (375 mil)
μ
PD17226GT-
×××
: 28-pin plastic SOP (375 mil)
μ
PD17227GT-
×××
: 28-pin plastic SOP (375 mil)
μ
PD17228GT-
×××
: 28-pin plastic SOP (375 mil)
Soldering Method
Soldering Conditions
Symbol
Infrated Reflow
Package peak temperature:  235 
°
C, Time:  30 seconds max. (210 
°
C min.),
Number of times:  2 max.
IR35-00-2
VPS
Package peak temperature:  215 
°
C, Time:  40 seconds max. (200 
°
C min.),
Number of times:  2 max.
VP15-00-2
Wave Soldering
Solder bath temperature:  260 
°
C max, Time:  10 seconds max., Number of times:
once, preheating temperature:  120 
°
C max. (package surface temperature)
WS66-00-1
Partial Heating
Pin temperature:  300 
°
C max., Time:  3 seconds max. (per side of device)
—
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
(2)
 μ
PD17225MC-
×××
-5A4:  30-pin plastic shrink SOP (300 mil)
μ
PD17226MC-
×××
-5A4:  30-pin plastic shrink SOP (300 mil)
μ
PD17227MC-
×××
-5A4:  30-pin plastic shrink SOP (300 mil)
μ
PD17228MC-
×××
-5A4:  30-pin plastic shrink SOP (300 mil)
Soldering Method
Soldering Conditions
Symbol
Infrated Reflow
Package peak temperature:  235 
°
C, Time:  30 seconds max. (210 
°
C min.),
Number of times:  3 max.
IR35-00-3
VPS
Package peak temperature:  215 
°
C, Time:  40 seconds max. (200 
°
C min.),
Number of times:  3 max.
VP15-00-3
Wave Soldering
Solder bath temperature:  260 
°
C max, Time:  10 seconds max., Number of times:
once, preheating temperature:  120 
°
C max. (package surface temperature)
WS66-00-1
Partial Heating
Pin temperature:  300 
°
C max., Time:  3 seconds max. (per side of device)
—
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
Table 16-2.  Soldering Conditions of Through-Hole Type
μ
PD17225CT-
×××
: 28-pin plastic shrink DIP (400 mil)
μ
PD17226CT-
×××
: 28-pin plastic shrink DIP (400 mil)
μ
PD17227CT-
×××
: 28-pin plastic shrink DIP (400 mil)
μ
PD17228CT-
×××
: 28-pin plastic shrink DIP (400 mil)
Soldering Method
Soldering Conditions
Wave Soldering
(Only for pins)
Solder bath temperature:  260 
°
C max., Time:  10 seconds max.
Partial Heating
Pin temperature:  300 
°
C max., Time:  3 seconds max. (per pin)
Caution The wave solding must be performed at the lead part only.  Note that the solder must not be directly
contacted to the package body.