- 您現(xiàn)在的位置：買賣IC網 > PDF目錄379493 > UPD17225GT (NEC Corp.) 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER PDF資料下載
參數(shù)資料
| 型號： | UPD17225GT |
| 廠商： | NEC Corp. |
| 元件分類： | 4位微控制器 |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| 中文描述： | 4位單片機的小型通用紅外遙控器 |
| 文件頁數(shù)： | 75/84頁 |
| 文件大小： | 393K |
| 代理商： | UPD17225GT |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁當前第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁
μ
PD17225, 17226, 17227, 17228
75
Data Sheet U12643EJ2V0DS00
16. RECOMMENDED SOLDERING CONDITIONS
For the
μ
PD17225 soldering must be performed under the following conditions.
For details of recommended conditions for surface mounting, refer to information document
"Semiconductor
Device Mounting Technology Manual" (C10535E)
.
For other soldering methods, please consult with NEC personnel.
Table 16-1. Soldering Conditions of Surface Mount Type
(1)
μ
PD17225GT-
×××
: 28-pin plastic SOP (375 mil)
μ
PD17226GT-
×××
: 28-pin plastic SOP (375 mil)
μ
PD17227GT-
×××
: 28-pin plastic SOP (375 mil)
μ
PD17228GT-
×××
: 28-pin plastic SOP (375 mil)
Soldering Method
Soldering Conditions
Symbol
Infrated Reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (210
°
C min.),
Number of times: 2 max.
IR35-00-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (200
°
C min.),
Number of times: 2 max.
VP15-00-2
Wave Soldering
Solder bath temperature: 260
°
C max, Time: 10 seconds max., Number of times:
once, preheating temperature: 120
°
C max. (package surface temperature)
WS66-00-1
Partial Heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
—
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
(2)
μ
PD17225MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
μ
PD17226MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
μ
PD17227MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
μ
PD17228MC-
×××
-5A4: 30-pin plastic shrink SOP (300 mil)
Soldering Method
Soldering Conditions
Symbol
Infrated Reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (210
°
C min.),
Number of times: 3 max.
IR35-00-3
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (200
°
C min.),
Number of times: 3 max.
VP15-00-3
Wave Soldering
Solder bath temperature: 260
°
C max, Time: 10 seconds max., Number of times:
once, preheating temperature: 120
°
C max. (package surface temperature)
WS66-00-1
Partial Heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per side of device)
—
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
Table 16-2. Soldering Conditions of Through-Hole Type
μ
PD17225CT-
×××
: 28-pin plastic shrink DIP (400 mil)
μ
PD17226CT-
×××
: 28-pin plastic shrink DIP (400 mil)
μ
PD17227CT-
×××
: 28-pin plastic shrink DIP (400 mil)
μ
PD17228CT-
×××
: 28-pin plastic shrink DIP (400 mil)
Soldering Method
Soldering Conditions
Wave Soldering
(Only for pins)
Solder bath temperature: 260
°
C max., Time: 10 seconds max.
Partial Heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin)
Caution The wave solding must be performed at the lead part only. Note that the solder must not be directly
contacted to the package body.
相關PDF資料 |
PDF描述 |
|---|---|
| UPD17225 | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17225CT | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17225MC | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17226 | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17226CT | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UPD17225GT-XXX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROCONTROLLER|4-BIT|UPD17K CPU|CMOS|SOP|28PIN|PLASTIC |
| UPD17225MC | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17225MC-XXX-5A4 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microcontroller |
| UPD17226 | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
| UPD17226CT | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER |
發(fā)布緊急采購，3分鐘左右您將得到回復。