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參數(shù)資料
| 型號： | UPD161643 |
| 英文描述： | UPD161643 Data Sheet | Data Sheet[02/2003] |
| 中文描述： | UPD161643數(shù)據(jù)表|數(shù)據(jù)表[02/2003] |
| 文件頁數(shù)： | 18/20頁 |
| 文件大?。?/td> | 157K |
| 代理商： | UPD161643 |
Data Sheet S15859EJ1V0DS
18
μ
PD160040
9. RECOMMENDED MOUNTING CONDITIONS
The following conditions must be met for mounting conditions of the
μ
PD160040.
For more details, refer to the
Semiconductor Device Mounting Technology Manual (C10535E).
Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under
different conditions.
μ
PD160040N-xxx: TCP (TAB Package)
Mounting Condition
Mounting Method
Condition
Thermocompression
Soldering
Heating tool 300 to 350
°
C, heating for 2 to 3 sec, pressure 100g (per
solder).
Temporary bonding 70 to 100
°
C, pressure 3 to 8 kg/cm
2
, time 3 to 5
sec. Real bonding 165 to 180
°
C, pressure 25 to 45 kg/cm
2
, time 30 to
ACF
(Adhesive Conductive
Film)
40 sec. (When using the anisotropy conductive film SUMIZAC1003 of
Sumitomo Bakelite, Ltd.)
Caution
To find out the detailed conditions for mounting the ACF part, please contact the ACF
manufacturing company. Be sure to avoid using two or more mounting methods at a time.
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