- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄361585 > UPC8120T IC PDF資料下載
參數(shù)資料
| 型號： | UPC8120T |
| 英文描述： | IC |
| 中文描述： | 集成電路 |
| 文件頁數(shù)： | 36/40頁 |
| 文件大小： | 371K |
| 代理商： | UPC8120T |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁當前第36頁第37頁第38頁第39頁第40頁
36
μ
PC8130TA,
μ
PC8131TA
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All
the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor (eg. 1000 pF) should be attached to the V
CC
pin.
(4) Impedance matching circuit must be each externally attached to input and output ports.
(5) The bias must be applied to output pin through the matching inductor. (The bias must not be applied to input
pin.)
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition
Symbol
Infrared Reflow
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit
Note
: None
IR35-00-3
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit
Note
: None
VP15-00-3
Wave Soldering
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit
Note
: None
WS60-00-1
Partial Heating
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit
Note
: None
–
Note
After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPC8126GR-E1 | RF Modulator |
| UPC8128TB-E3 | Microwave/Millimeter Wave Amplifier |
| UPC8129GR | Analog IC |
| UPC813 | UPC813 Data Sheet | Data Sheet[03/1993] |
| UPC8186K-E1 | RF MODULATOR|BIPOLAR|LLCC|24PIN|PLASTIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPC8120T-A | 制造商:Renesas Electronics 功能描述:1 Gain Amplifier Cut Tape |
| UPC8120T-E3 | 功能描述:射頻放大器 1.9GHz AGC Amplifier RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| UPC8120T-E3-A | 制造商:California Eastern Laboratories (CEL) 功能描述:RF Amp Chip Single Gain Amp 1.92GHz 3.3V 6-Pin Mini-Mold T/R |
| UPC8125 | 制造商:NEC 制造商全稱:NEC 功能描述:UP-CONVERTER WITH AGC FUNCTION QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS |
| UPC8125GR | 制造商:NEC 制造商全稱:NEC 功能描述:UP-CONVERTER WITH AGC FUNCTION QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。