- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄361585 > UPC811 UPC811 Data Sheet | Data Sheet[03/1993] PDF資料下載
參數(shù)資料
| 型號： | UPC811 |
| 英文描述： | UPC811 Data Sheet | Data Sheet[03/1993] |
| 中文描述： | UPC811數(shù)據(jù)表|數(shù)據(jù)表[03/1993] |
| 文件頁數(shù)： | 36/40頁 |
| 文件大?。?/td> | 371K |
| 代理商： | UPC811 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁當(dāng)前第36頁第37頁第38頁第39頁第40頁
36
μ
PC8130TA,
μ
PC8131TA
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All
the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor (eg. 1000 pF) should be attached to the V
CC
pin.
(4) Impedance matching circuit must be each externally attached to input and output ports.
(5) The bias must be applied to output pin through the matching inductor. (The bias must not be applied to input
pin.)
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition
Symbol
Infrared Reflow
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit
Note
: None
IR35-00-3
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit
Note
: None
VP15-00-3
Wave Soldering
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit
Note
: None
WS60-00-1
Partial Heating
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit
Note
: None
–
Note
After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPC8112TB | IC |
| UPC8112T-E3 | Analog IC |
| UPC8119T-E3 | Microwave/Millimeter Wave Amplifier |
| UPC812 | UPC812 Data Sheet | Data Sheet[03/1993] |
| UPC8120T | IC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPC8110GR | 制造商:NEC 制造商全稱:NEC 功能描述:UP-CONVERTER WITH AGC FUNCTION QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS |
| UPC8110GR_00 | 制造商:NEC 制造商全稱:NEC 功能描述:1 GHz QUADRATURE MODULATOR |
| UPC8110GR-E1 | 功能描述:調(diào)節(jié)器/解調(diào)器 DISC BY MFG 08/30/2002 RoHS:否 制造商:Texas Instruments 封裝 / 箱體:PVQFN-N24 封裝:Reel |
| UPC8112T | 制造商:NEC 制造商全稱:NEC 功能描述:SILICON MMIC 1st FREQUENCY DOWN-CONVERTER FOR CELLULAR/CORDLESS TELEPHONE |
| UPC8112TB | 功能描述:上下轉(zhuǎn)換器 3V Freq Dwn Convertr RoHS:否 制造商:Texas Instruments 產(chǎn)品:Down Converters 射頻:52 MHz to 78 MHz 中頻:300 MHz LO頻率: 功率增益: P1dB: 工作電源電壓:1.8 V, 3.3 V 工作電源電流:120 mA 最大功率耗散:1 W 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFP-128 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。