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參數(shù)資料
| 型號： | UPC659AGS |
| 廠商： | NEC Corp. |
| 英文描述： | 8-BIT A/D CONVERTER FOR VIDEO PROCESSING WITH REFERENCE GENERATOR AND CLAMP CIRCUIT |
| 中文描述： | 8位A / D的視頻與參考發(fā)生器和鉗位電路處理轉(zhuǎn)爐 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大?。?/td> | 123K |
| 代理商： | UPC659AGS |
14
μ
PC659A
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document
“SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E)
.
Surface mount device
μ
PC659AGS : 24-pin plastic SOP (300 mil)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235 C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 C or higher),
Maximum number of reflow processes: 2 times.
IR35-00-2
Vapor phase soldering
Peak temperature: 215 C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 C or higher),
Maximum number of reflow processes: 2 times.
VP15-00-2
Wave Soldering
Solder temperature: 260 C or below,
Flow time: 10 seconds or less,
Pre-heating temperature: 120 C or below
WS60-00-1
(Package surface temperature),
Maximum number of flow processes: 1 time.
Partial heating method
Pin terminal temperature: 300 C or below,
Heat time: 3 seconds or less (Per each side of the device).
–
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or
the device will be damaged by heat stress.
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