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參數(shù)資料
| 型號： | UPC37M31TJ |
| 廠商： | NEC Corp. |
| 英文描述： | BIPOLAR ANALOG INTEGRATED CIRCUIT |
| 中文描述： | 雙極模擬集成電路 |
| 文件頁數(shù)： | 12/14頁 |
| 文件大小： | 113K |
| 代理商： | UPC37M31TJ |
Data Sheet G16444EJ2V0DS
12
μ
PC37Mxx Series
RECOMMENDED MOUNTING CONDITIONS
The following conditions must be met for mounting conditions of the
μ
PC37Mxx series.
For more details, refer to the
Semiconductor Device Mount Manual
(http://www.necel.com/pkg/en/mount/index.html).
Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under
different conditions.
Type of Surface Mount Device
μ
PC37MxxTJ: SC-98 (5-pin MP-3Z)
Process
Conditions
Symbol
Infrared Ray Reflow
Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflows processes: 3 times or less.
IR35-00-3
Vapor Phase Soldering
Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflows processes: 3 times or less.
VP15-00-3
Wave Soldering
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
WS60-00-1
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
–
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
μ
PC37MxxHB: SC-99 (5-pin MP-3)
Process
Conditions
Wave Soldering
(only to leads)
Solder temperature: 260°C or below,
Flow time: 10 seconds or less
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
#
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