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參數(shù)資料
| 型號(hào)： | UPC3033H |
| 元件分類(lèi)： | 固定正電壓?jiǎn)温份敵鯨DO穩(wěn)壓器 |
| 英文描述： | 3.3 V FIXED POSITIVE LDO REGULATOR, 0.6 V DROPOUT, PSFM4 |
| 封裝： | PLASTIC, TO-126, SIP-4 |
| 文件頁(yè)數(shù)： | 3/13頁(yè) |
| 文件大?。?/td> | 320K |
| 代理商： | UPC3033H |
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Data Sheet G17372EJ2V0DS
9
μ PC3033,3005
RECOMMENDED SOLDERING CONDITIONS
The
μPC3033,3005 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Through-hole devices
μPC3033H, μPC3005H: 4-pin plastic SIP (TO-126)
Process
Conditions
Recommend
Wave soldering
(only to leads)
Solder temperature: 260°C or below,
Flow time: 10 seconds or less.
WS60-00-1
Partial heating method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each pin).
P300
μPC3033H-AZ, μPC3005H-AZ: 4-pin plastic SIP (TO-126) Note
Process
Conditions
Recommend
Wave soldering
(only to leads)
Solder temperature: 260°C or below,
Flow time: 10 seconds or less.
WS60-00-1
Partial heating method
Pin temperature: 350°C or below,
Heat time: 3 seconds or less (Per each pin).
P350
Note Pb-free (This product does not contain Pb in external electrode.)
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
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| UPC3033H(AZ) | 制造商:Renesas Electronics Corporation 功能描述: |
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