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參數(shù)資料
| 型號(hào)： | UPC2795GV-E1 |
| 廠商： | NEC Corp. |
| 英文描述： | GENERAL PURPOSE L-BAND DOWN CONVERTER |
| 中文描述： | 一般用途L波段下變頻器 |
| 文件頁(yè)數(shù)： | 11/12頁(yè) |
| 文件大小： | 133K |
| 代理商： | UPC2795GV-E1 |
11
μ
PC2795GV
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) A low pass filter must be attached to V
CC
line.
(5) A matching circuit must be externally attached to output port.
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales officers in case other soldering process is used or in case soldering is done under
different conditions.
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
μ
PC2795GV
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package’s surface temperature: 235
°
C or below,
Reflow time: 30 seconds or below (210
°
C or higher),
Number of reflow process: 3, Exposure limit
Note
: None
IR35-00-3
VPS
Peak package’s surface temperature: 215
°
C or below,
Reflow time: 40 seconds or below (200
°
C or higher),
Number of reflow process: 3, Exposure limit
Note
: None
VP15-00-3
Wave soldering
Solder temperature: 260°C or below,
Reflow time: 10 seconds or below,
Number of reflow process: 1, Exposure limit
Note
: None
WS60-00-1
Partial heating
method
Terminal temperature: 300
°
C or below,
Flow time: 3 seconds or below,
Exposure limit
Note
: None
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25
°
C and relative humidity at 65 % or less.
Caution Do not apply more than single process at once, except for “Partial heating method”.
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