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參數(shù)資料
| 型號(hào)： | UPC2792TB-E3 |
| 廠(chǎng)商： | NEC Corp. |
| 英文描述： | 5 V, SUPER MINIMOLD SILICON MMIC VHF-UHF WIDEBAND AMPLIFIER |
| 中文描述： | 5伏，超級(jí)MINIMOLD硅單片高頻，超高頻寬帶放大器 |
| 文件頁(yè)數(shù)： | 16/20頁(yè) |
| 文件大小： | 114K |
| 代理商： | UPC2792TB-E3 |
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Data Sheet P11863EJ2V0DS00
16
μ
PC2791TB,
μ
PC2792TB
NOTES ON CORRECT USE
(1) Observe precautions for handiling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to V
CC
line.
(4) The DC cut capacitor must be each attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limit: None
Note
IR35-00-3
VPS
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limit: None
Note
VP15-00-3
Partial Heating
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
–
Note
After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E)
.
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| UPC2795 | 制造商:NEC 制造商全稱(chēng):NEC 功能描述:GENERAL PURPOSE L-BAND DOWN CONVERTER |
| UPC2795GV | 制造商:NEC 制造商全稱(chēng):NEC 功能描述:GENERAL PURPOSE L-BAND DOWN CONVERTER |
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