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參數(shù)資料
| 型號： | UPC2260 |
| 英文描述： | UPC2260 Data Sheet | Data Sheet[06/2000] |
| 中文描述： | UPC2260數(shù)據(jù)表|數(shù)據(jù)表[06/2000] |
| 文件頁數(shù)： | 10/12頁 |
| 文件大?。?/td> | 72K |
| 代理商： | UPC2260 |
Data Sheet G14451EJ2V0DS00
10
μ
PC2250 SERIES
RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended, consult NEC.
Through Hole Type Soldering Conditions
μ
PC2251H, 2253H, 2255H: 4-pin plastic SIP (TO-126)
Soldering Method
Soldering Conditions
Wave soldering (Pins only)
Solder bath temperature: 260
°
C max., Time: 10 sec max.
Partial heating
Pin temperature: 300
°
C max., Time: 3 sec max. (per pin)
Caution When soldering this product using wave soldering, exercise care that the solder does not come
in direct contact with the package.
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