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參數(shù)資料
| 型號： | ULLC0402FC3.3C |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| 中文描述： | UNBUMPED低電容倒裝芯片陣列 |
| 文件頁數(shù)： | 2/4頁 |
| 文件大小： | 159K |
| 代理商： | ULLC0402FC3.3C |
2
www.protekdevices.com
05192.R0 8/03
ULLC0402FC3.3C*
thru
ULLC0402FC24C*
*PATENT PENDING
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
Operating Temperature
SYMBOL
T
J
T
STG
VALUE
-55
°
C to 150
°
C
°C
°C
-55
°
C to 150
°
C
UNITS
PARAMETER
Storage Temperature
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
VOLTS
4.0
6.0
8.5
13.3
16.7
26.7
TYPICAL
CAPACITANCE
@0V, 1 MHz
C
pF
ULLC0402FC3.3C
ULLC0402FC05C
ULLC0402FC08C
ULLC0402FC12C
ULLC0402FC15C
ULLC0402FC24C
3.3
5.0
8.0
12.0
15.0
24.0
6
6
6
6
6
6
MAXIMUM
LEAKAGE
CURRENT
@V
WM
I
D
μA
75
1.0
0.1
0.1
0.1
0.1
RATED
STAND-OFF
VOLTAGE
V
VOLTS
Note 1:
All devices are bidirectional.
225°C
5-10 sec
Instantaneous
to 200°C
Soldering
Time
Cool Down
Time
1-2 Minutes
to 150°C
1-2 Minutes to 25°C
Pre-Heat
Time
100°C
200°C
Note:
This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.
FIGURE 1
REFLOW SOLDER PROFILE
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