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參數(shù)資料
| 型號(hào)： | ULLC0402FC08C |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| 中文描述： | UNBUMPED低電容倒裝芯片陣列 |
| 文件頁(yè)數(shù)： | 4/4頁(yè) |
| 文件大?。?/td> | 159K |
| 代理商： | ULLC0402FC08C |
4
www.protekdevices.com
05192.R0 8/03
ULLC0402FC3.3C*
thru
ULLC0402FC24C*
*PATENT PENDING
PACKAGE OUTLINE & DIMENSIONS
COPYRIGHT ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA 481.
2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., ULLC0402FC05C-T75-1).
3. 8mm Paper Tape: 7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., ULLC0402FC05C-T710-2).
A
B
C
D
E
F
I
0.46 NOM
0.86 NOM
0.99 ± 0.0254
0.10 NOM
0.35 NOM
0.483 ± 0.0254
0.406 NOM
0.018 NOM
0.034 NOM
0.039 ± 0.001
0.004 NOM
0.014 NOM
0.019 ± 0.001
0.016 NOM
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and outline:
.xxx ± 0.05mm (± 0.002
”
).
3. Maximum chip size: 1.02 (0.040
”
) by 0.51(0.020
”
).
PACKAGE OUTLINE
U0402
MOUNTING PAD
NOTE:
1. Preferred:Using 0.1mm (0.004
”
) stencil.
D
E
F
I
S
A
B
C
TOP
END
Metalized Die Contacts
A
B
C
D
E
F
G
H
I
0.23
0.48
0.69
0.46
0.99
0.20
0.20
0.66
0.13
0.009
0.019
0.027
0.018
0.039
0.008
0.008
0.026
0.005
DIM
MILLIMETERS
INCHES
PAD DIMENSIONS
NOTE:
1. Top view of tape. Metal contacts are face down in tape
package.
TAPE & REEL ORIENTATION
Single Die - 0402
B
C
DIE
CONTACTS
A
H
D
I
SOLDER PRINT
DIAMETER 0.010” -
0.012”
F
G
DIE
E
S
Outline & Dimensions: Rev 3 - 11/02, 06020
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PDF描述 |
|---|---|
| ULLC0402FC15C | UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| ULLC0402FC24C | UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| ULLC0402FC3.3C | UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| ULLC0402FC33C | UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| ULLC0408FC05C | UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ULLC0402FC12C | 制造商:PROTEC 制造商全稱(chēng):Protek Devices 功能描述:UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| ULLC0402FC15C | 制造商:PROTEC 制造商全稱(chēng):Protek Devices 功能描述:UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| ULLC0402FC24C | 制造商:PROTEC 制造商全稱(chēng):Protek Devices 功能描述:UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| ULLC0402FC3.3C | 制造商:PROTEC 制造商全稱(chēng):Protek Devices 功能描述:UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| ULLC0402FC33C | 制造商:PROTEC 制造商全稱(chēng):Protek Devices 功能描述:UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
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