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參數資料
| 型號： | ULLC0402FC05C-T710-2 |
| 廠商： | PROTEK DEVICES |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| 中文描述： | BIDIRECTIONAL, SILICON, TVS DIODE |
| 封裝： | ROHS COMPLIANT, U0402, FLIP CHIP-4 |
| 文件頁數： | 4/5頁 |
| 文件大?。?/td> | 86K |
| 代理商： | ULLC0402FC05C-T710-2 |
4
05192.R3 8/06
www.protekdevices.com
ULLC0402FC05C
Ramp-up
Ramp-down
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
T
S
- Preheat
T
SMAX
T
SMIN
T
L
t 25°C to Peak
30-60 seconds
T
T
P
155°
140°
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50μm
±20μm
60 Seconds
270°C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-270°C
T
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
APPLICATION INFORMATION
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相關代理商/技術參數 |
參數描述 |
|---|---|
| ULLC0402FC05C-T75-1 | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| ULLC0402FC08C | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| ULLC0402FC12C | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| ULLC0402FC15C | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
| ULLC0402FC24C | 制造商:PROTEC 制造商全稱:Protek Devices 功能描述:UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY |
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