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參數(shù)資料
| 型號： | UCC81510N |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | Transition-mode PFC controller |
| 中文描述： | 模擬IC |
| 文件頁數(shù)： | 2/10頁 |
| 文件大?。?/td> | 196K |
| 代理商： | UCC81510N |
SLUS457B – JULY 2000 - REVISED OCTOBER 2000
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
description (continued)
Other features include an open-drain fault output indicator, thermal shutdown, undervoltage lockout, 3 V to 6 V
operation, and a low thermal resistance small-outline power package.
functional block diagram
9
8
5
4
13
12
10
6
7
3
2
1
INTERNAL
BIAS
THERMAL
SHUTDOWN
ON TIME
CONTROL
3% DUTY
CYCLE
CHARGE
PUMP
16
15
14
VIN
VIN
VIN
VOUT
VOUT
VOUT
SHTDWN
FAULT
CT
HEAT SINK GND
PINS
GND
IFAULT
IMAX
CURRENT
FAULT LEVEL
OVERLOAD
COMPARATOR
OVERCURRENT
COMPARATOR
+
REVERSE
COMPARATOR
V
OUT
+
20mV
CURRENT SENSE
1.5V
H = OPEN
MAXIMUM
CURRENT
LEVEL
+
+
+
+
+
UDG–00101
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Input voltage
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SOIC power dissipation
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Fault output sink current
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Fault output voltage
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current (dc)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage SHTDWN, IFAULT, IMAX
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, T
J
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering, 10 seconds)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8 V
2.5 W
50 mA
VIN
Internally Limited
–0.3 V to VIN
–65 C to 150 C
–55 C to 150 C
300 C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Unless otherwise indicated, voltages are reference to ground and currents are positive into, negative out of the specified terminal. Pulsed is
defined as a less than 10% duty cycle with a maximum duration of 500
μ
s. Consult Packaging Sectionof Databook for thermal limitations and
considerations of package.
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