
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Supply Current Section
Termpwr Supply Current
All termination lines = Open
All termination lines = 0.5V
DISCNCT = Open
20
400
100
29
435
150
mA
mA
μ
A
Power Down Mode
Output Section (Termination Lines)
Termination Impedance
I
LINE
= -5mA to -15mA
TJ = 25
°
C
0°C < T
J
< 70°C
T
J
= 25
°
C
0°C < T
J
< 70°C
T
J
= 25
°
C
0°C < T
J
< 70°C
T
J
= 25
°
C
0°C < T
J
< 70°C
V
LINE
= 0 to 4V
V
LINE
= 5.25V
102
97
2.6
2.55
-19.5
-18.5
-18.0
-17.0
110
118
129
3.1
3.2
-22.4
-22.4
-22.4
-22.4
400
100
400
V
V
mA
mA
mA
mA
nA
μ
A
nA
Output High Voltage
V
TRMPWR
= 4V (Note 1)
2.9
Max Output Current
V
LINE
= 0.5V
-21.4
Max Output Current
V
LINE
= 0.5V, TRMPWR = 4V (Note 1)
-21.5
Output Leakage
DISCNCT = 4V
TRMPWR = 0V to 5.25V
REG = 0V
TRMPWR = 0V to 5.25V, REG = Open
V
LINE
= 0V to 5.25V
DISCNCT = Open (Note 2)
10
10
Output Capacitance
Regulator Section
Regulator Output Voltage
10
13
pF
T
J
= 25
°
C
0°C < T
J
< 70°C
2.7
2.55
2.9
3.1
3.2
20
50
1.2
-850
V
V
Line Regulation
Load Regulation
Drop Out Voltage
Short Circuit Current
Sinking Current Capability
Thermal Shutdown
Disconnect Section
Disconnect Threshold
Threshold Hysteresis
Input Current
Note 1: Measuring each termination line while other 17 are low (0.5V).
Note 2: Guaranteed by design. Not 100% tested in production.
TRMPWR = 4V to 6V
I
REG
= 0 to -400mA
All Termination Lines = 0.5V
V
REG
= 0V
V
REG
= 3.5V
10
20
1.0
-650
40
170
mV
mV
V
mA
mA
°C
-450
20
1.1
1.4
100
150
1.7
V
mV
μ
A
DISCNCT = 0V
200
ELECTRICAL CHARACTERISTICS
Unless otherwise stated, these specifications apply for T
A
= 0°C to 70°C.
TRMPWR = 4.75V, DISCNCT = 0V. T
A
= T
J
.
UC5602
DWP package: (see packaging section of UICC data book for more details on thermal performance)
Thermal Resistance Junction to Leads,
θ
jL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18°C/W
Thermal Resistance Junction to Ambient,
θ
ja. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33°-43°C/W
N package:
Thermal Resistance Junction to Leads,
θ
jL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50°C/W
Thermal Resistance Junction to Ambient,
θ
ja. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°-105°C/W
QP package:
Thermal Resistance Junction to Leads,
θ
jL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15°C/W
Thermal Resistance Junction to Ambient,
θ
ja. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30°-40°C/W
Note: The above numbers for
θ
jL are maximums for the limiting thermal resistance of the package in a standard mounting configu-
ration. The
θ
ja numbers are meant to be guidelines for the thermal performance of the device/pc-board system. All of the above
numbers assume no ambient airflow.
THERMAL DATA
3
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