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參數(shù)資料
| 型號(hào)： | U6805B |
| 英文描述： | Hex-Driver with Thermal Monitoring |
| 中文描述： | 六角與熱監(jiān)測(cè)驅(qū)動(dòng)程序 |
| 文件頁數(shù)： | 5/5頁 |
| 文件大?。?/td> | 117K |
| 代理商： | U6805B |
U6805B
TELEFUNKEN Semiconductors
Rev. A3, 28-Apr-97
5 (5)
Ozone Depleting Substances Policy Statement
It is the policy of
TEMIC TELEFUNKEN microelectronic GmbH
to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH
semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
TEMIC
can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice
.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
相關(guān)PDF資料 |
PDF描述 |
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| U6805B-FP | Hex-Driver with Thermal Monitoring |
| U6806B-FL | Hex Peripheral Driver |
| U6807B-FP | Hex Peripheral Driver |
| U6807B | Hex-Driver for High Temperature Application |
| U690B | Rear Wiper Interval/Wipe-Wash Control |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| U6805B-FP | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:HEX DRIVER IC WITH THERMAL MONITORING |
| U6805B-MFPG3 | 功能描述:IC DRIVER HEX THERMAL MON 14SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:- 應(yīng)用說明:Ultrasound Imaging Systems Application Note 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:37 系列:- 應(yīng)用:醫(yī)療用超聲波成像，聲納 電流 - 電源:- 電源電壓:2.37 V ~ 6 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:56-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-TQFN-EP（8x8） 包裝:管件 |
| U6805B-MFPG3Y | 功能描述:IC DRIVER HEX THERMAL MON 14SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:- 應(yīng)用說明:Ultrasound Imaging Systems Application Note 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:37 系列:- 應(yīng)用:醫(yī)療用超聲波成像，聲納 電流 - 電源:- 電源電壓:2.37 V ~ 6 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:56-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-TQFN-EP（8x8） 包裝:管件 |
| U6805B-MFPG3Y71 | 功能描述:射頻無線雜項(xiàng) 6x25mA Hex driver w/thermal mon. RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
| U6806B-FL | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Hex Peripheral Driver |
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