參數(shù)資料
型號(hào): TZA3044TT
廠(chǎng)商: NXP SEMICONDUCTORS
元件分類(lèi): 通信及網(wǎng)絡(luò)
英文描述: SDH/SONET STM4/OC12 and 1.25 Gbits/s Gigabit Ethernet postamplifiers
中文描述: SPECIALTY TELECOM CIRCUIT, PDSO16
封裝: PLASTIC, TSSOP-16
文件頁(yè)數(shù): 21/28頁(yè)
文件大小: 151K
代理商: TZA3044TT
1999 Nov 03
21
Philips Semiconductors
Product specification
SDH/SONET STM4/OC12 and
1.25 Gbits/s Gigabit Ethernet postamplifiers
TZA3044; TZA3044B
Physical characteristics of bare die
PARAMETER
VALUE
Glass passivation
Bonding pad dimension
Metallization
Thickness
Size
Backing
Attache temperature
Attache time
2.1
μ
m PSG (PhosphoSilicate Glass) on top of 0.65
μ
m oxynitride
minimum dimension of exposed metallization is 90
×
90
μ
m (pad size = 100
×
100
μ
m)
1.22
μ
m W/AlCu/TiW
380
μ
m nominal
1.55
×
1.55 mm (2.4 mm
2
)
silicon; electrically connected to GND potential through substrate contacts
<440
°
C; recommended die attache is glue
<15 s
Fig.27 Bonding pad locations of TZA3044U and TZA3044BU.
handbook, full pagewidth
AGND
4
VCCD
27
TEST
26
DGND
25
DOUT
24
DOUTQ
23
DGND
22
TEST
21
DGND
20
AGND
6
DIN
7
DINQ
8
AGND
9
TEST
10
VCCA
11
n.c.
5
TZA3044U
TZA3044BU
12
V
3
A
2
T
1
S
32
n
31
n
30
R
29
V
28
V
13
C
14
S
15
T
16
J
17
S
18
S
19
D
MGR242
1.55
(1)
mm
1.55
(1)
mm
x
y
0
0
(1) Typical value.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TZA3044U 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:1.25 Gbits/s Gigabit Ethernet postamplifiers
TZA3047A 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:30 Mbits/s up to 1.25 Gbits/s laser drivers
TZA3047AVH 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:30 Mbits/s up to 1.25 Gbits/s laser drivers
TZA3047B 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:30 Mbits/s up to 1.25 Gbits/s laser drivers
TZA3047BVH 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:30 Mbits/s up to 1.25 Gbits/s laser drivers