參數(shù)資料
型號(hào)： TZA3044BU
廠商： NXP SEMICONDUCTORS
元件分類： 通信及網(wǎng)絡(luò)
英文描述： SDH/SONET STM4/OC12 and 1.25 Gbits/s Gigabit Ethernet postamplifiers
中文描述： SPECIALTY TELECOM CIRCUIT, UUC29
封裝： 1.55 X 1.55 MM, DIE-29
文件頁數(shù)： 25/28頁
文件大小： 151K
代理商： TZA3044BU
1999 Nov 03
25
Philips Semiconductors
Product specification
SDH/SONET STM4/OC12 and
1.25 Gbits/s Gigabit Ethernet postamplifiers
TZA3044; TZA3044B
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料
PDF描述
TZA3044TT SDH/SONET STM4/OC12 and 1.25 Gbits/s Gigabit Ethernet postamplifiers
TZA3044U SDH/SONET STM4/OC12 and 1.25 Gbits/s Gigabit Ethernet postamplifiers
TZB4Z030AB10R00 TRANSIL
TZB4Z060AB10R00 TRANSIL
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TZA3044T 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SDH/SONET STM4/OC12 and 1.25 Gbits/s Gigabit Ethernet postamplifiers
TZA3044TT 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SDH/SONET STM4/OC12 and 1.25 Gbits/s Gigabit Ethernet postamplifiers
TZA3044U 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.25 Gbits/s Gigabit Ethernet postamplifiers
TZA3047A 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:30 Mbits/s up to 1.25 Gbits/s laser drivers
TZA3047AVH 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:30 Mbits/s up to 1.25 Gbits/s laser drivers
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