參數(shù)資料
型號: TZA3044BTT
廠商: NXP SEMICONDUCTORS
元件分類: 通信及網(wǎng)絡(luò)
英文描述: SDH/SONET STM4/OC12 and 1.25 Gbits/s Gigabit Ethernet postamplifiers
中文描述: SPECIALTY TELECOM CIRCUIT, PDSO16
封裝: PLASTIC, TSSOP-16
文件頁數(shù): 10/28頁
文件大小: 151K
代理商: TZA3044BTT
1999 Nov 03
10
Philips Semiconductors
Product specification
SDH/SONET STM4/OC12 and
1.25 Gbits/s Gigabit Ethernet postamplifiers
TZA3044; TZA3044B
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1.
For the TZA3044B the minimum value is
0.5 V for ST and STQ outputs.
HANDLING
This device is ESD sensitive and should be handled with care. Precautions should be taken to avoid damage through
electrostatic discharge. This is particularly important during assembly and handling of the bare die. Additional safety can
be obtained by bonding the V
CC
and GND pads first, the remaining pads may then be bonded to their external
connections in any order.
THERMAL CHARACTERISTICS
Note
1.
Thermal resistance from junction to ambient is determined with the IC soldered on a standard single-sided
57
×
57
×
1.6 mm FR4 epoxy printed-circuit board with 35
μ
m thick copper traces. The measurements are performed
in still air.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CC
V
n
supply voltage
DC voltage
pins DIN, DINQ, CF, JAM and RSET
pins ST, STQ, DOUT and DOUTQ
pin V
ref
DC current
pins DIN, DINQ, CF and JAM
pins ST, STQ, DOUT and DOUTQ
pin V
ref
pin RSET
total power dissipation
storage temperature
junction temperature
ambient temperature
0.5
+6
V
0.5
V
CC
2
0.5
V
CC
+ 0.5
V
CC
+ 0.5
+3.2
V
V
V
note 1
I
n
1
25
2
2
65
40
+1
+10
+2.5
+2
300
+150
150
+85
mA
mA
mA
mA
mW
°
C
°
C
°
C
P
tot
T
stg
T
j
T
amb
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
SO16 package
TSSOP16 package
note 1
115
150
K/W
K/W
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