參數(shù)資料
型號(hào)： TZA3001AHL
廠商： NXP SEMICONDUCTORS
元件分類： 其它接口
英文描述： SDH/SONET STM4/OC12 laser driver(SDH/SONET STM4/OC12 激光驅(qū)動(dòng)器)
中文描述： SPECIALTY INTERFACE CIRCUIT, PQFP32
封裝： 5 X 5 X 1.40 MM, PLASTIC, LQFP-32
文件頁數(shù)： 27/32頁
文件大?。?/td> 137K
代理商： TZA3001AHL
2000 Feb 22
27
Philips Semiconductors
Product specification
SDH/SONET STM4/OC12 laser drivers
TZA3001AHL; TZA3001BHL;
TZA3001U
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料
PDF描述
TZA3001A SDH/SONET STM4/OC12 laser driver(SDH/SONET STM4/OC12 激光驅(qū)動(dòng)器)
TZA3005 SDH/SONET STM1/OC3 and STM4/OC12 transceiver
TZA3023 SDH/SONET STM4/OC12 transimpedance amplifier
TZA3023T SDH/SONET STM4/OC12 transimpedance amplifier
TZA3023U SDH/SONET STM4/OC12 transimpedance amplifier
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TZA3001BHL 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SDH/SONET STM4/OC12 laser drivers
TZA3001U 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SDH/SONET STM4/OC12 laser drivers
TZA3004 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SDH/SONET STM1/OC3 and STM4/OC12 transceiver
TZA3004HL 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SDH/SONET data and clock recovery unit STM1/4 OC3/12
TZA3005 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SDH/SONET STM1/OC3 and STM4/OC12 transceiver
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