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參數(shù)資料
| 型號： | TSTM872-20 |
| 廠商： | 意法半導體 |
| 英文描述： | RF Power Module Mobile Applications(RF功率模塊) |
| 中文描述： | 射頻功率模塊移動應用（射頻功率模塊） |
| 文件頁數(shù)： | 3/4頁 |
| 文件大?。?/td> | 47K |
| 代理商： | TSTM872-20 |
APPLICATIONS RECOMMENDATIONS
OPERATION LIMITS
The TSTM872-20 power module should never be
operated under any condition which exceeds the
Absolute Maximum Ratings presented on this
data sheet. Nor should the module be operated
continuously at any of the specified maximum rat-
ings. If the module is to be subjected to one or
more of the maximum rating conditions, care
must be taken to monitor other parameters which
may be affected.
DECOUPLING
Failure to properly decouple any of the voltage
supply pins will result in oscillations at certain op-
erating frequencies. Therefore, it is recommended
that these pins be bypassed as indicated in the
Module DC and Test Fixture Configuration draw-
ing of this data sheet.
MODULE MOUNTING
To insure adequate thermal transfer from the
module to the heatsink, it is recommended that a
satisfactory thermal compound such as Dow
Corning 340, Wakefield 120-2 or equivalent be
applied between the module flange and the
heatsink.
The heatsink mounting surface under the module
should be flat to within +/- 0.05 mm (+/- 0.002
inch). The module should be mounted to the
heatsink using 3.5 mm (or 6-32) or equivalent
screws torques to 5-6 kg-cm (4-6 in-lb).
The module leads should be attached to equip-
ment PC board using 180
°
C solder applied to the
leads with a properly grounded soldering iron tip,
not to exceed 195
°
C, applied a minimum of 2 mm
(0.080”) from the body of the module for a dura-
tion not to exceed 15 seconds per lead. It is im-
perative that no other portion of the module, other
than the leads, be subjected to temperatures in
excess of 100
°
C (maximum storage temperature),
for any period of time, as the plastic moulded
cover, internal components and sealing adhesives
may be adversely affected by such conditions.
Due to the construction techniques and materials
used within the module, reflow soldering of the
flange heatsink or leads, is not recommended.
TSTM872-20
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