型號: | TST0951B-MFDG3 |
英文描述: | MICROWAVE/MILLIMETER WAVE AMPLIFIER|SINGLE|BIPOLAR|TSSOP|8PIN|PLASTIC |
中文描述: | 微波/毫米波放大器|單|雙極| TSSOP封裝| 8引腳|塑料 |
文件頁數: | 4/5頁 |
文件大小: | 163K |
代理商: | TST0951B-MFDG3 |
相關PDF資料 |
PDF描述 |
---|---|
TST0951-MFDG3 | MICROWAVE/MILLIMETER WAVE AMPLIFIER|SINGLE|TSSOP|8PIN|PLASTIC |
TSTM872-20 | RF Power Module Mobile Applications(RF功率模塊) |
TSX10A-26057 | For the CSR Bluetooth products |
TSZ1J2A45-N | TOSHIBA SOLID DTATD AC RELAY |
TSZ2G45S | 128 x 64 pixel format, LED or EL Backlight available |
相關代理商/技術參數 |
參數描述 |
---|---|
TST0951-MFDG3 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROWAVE/MILLIMETER WAVE AMPLIFIER|SINGLE|TSSOP|8PIN|PLASTIC |
TST09PF00 | 制造商:ITT Interconnect Solutions 功能描述:PLUG FREE 9WAY 制造商:ITT Interconnect Solutions 功能描述:PLUG, FREE, 9WAY 制造商:ITT Interconnect Solutions 功能描述:PLUG, FREE, 9WAY; Connector Mounting:Cable; SVHC:No SVHC (19-Dec-2012); Series:TRIDENT; Colour:Black; Connector Insert Type:Male; Connector Mounting Orientation:Cable; Connector Type:Rectangular Power; Contact Gender:Pin; Contact ;RoHS Compliant: Yes |
TST09PF00 | 制造商:ITT Interconnect Solutions 功能描述:PLUG FREE 9 WAY |
TST09RD01T | 制造商:ITT Interconnect Solutions 功能描述:HEADER 9WAY 制造商:ITT Interconnect Solutions 功能描述:HEADER, 9WAY 制造商:ITT Interconnect Solutions 功能描述:HEADER, 9WAY; Connector Type:Wire to Board; Series:Trident; Contact Termination:Through Hole Vertical; Gender:Header; No. of Contacts:9; No. of Rows:1; Pitch Spacing:5.08mm; Contact Plating:Tin; SVHC:No SVHC (19-Dec-2012); ;RoHS Compliant: Yes |
TST09RD01T | 制造商:ITT Interconnect Solutions 功能描述:HEADER 9WAY |