參數(shù)資料
型號: TSS461C
英文描述: Van Controller Serial Interface
中文描述: 范控制器串行接口
文件頁數(shù): 9/24頁
文件大?。?/td> 215K
代理商: TSS461C
Qualpack TSS463 / TSS461C
Rev. 2 – January 1999
9
3.6 Wafer Process Control
All the inspections and controls are defined as a process step in the production management software,
and are led by using a centralized SPC software. PC system could be summarized as follows:
-
NANTES
:
hermetic packages
-
Subcontractors
:
plastic packages
Engineering Database
Physical
-
NANTES
:
hermetic packages
-
Subcontractors
:
plastic packages
Critical process parameters are identified by using F.M.E.A. and other advanced tools.
Those parameters are followed in real time with the SPC methodology and their capability is measured
and monthly reported in the Operation Review.
For end 1997, the Cpk target is the following :
all parameters with Cpk above 1.67
% of all Parameters per Cpk categories
0%
20%
40%
60%
80%
100%
1995
1996
Q1-
Q2
97
Q3-
Q4
97
Obj.
98
>2
<2
<1.67
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