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| 型號(hào)： | TSL260RSM-LF |
| 廠(chǎng)商： | AMS-TAOS USA Inc |
| 文件頁(yè)數(shù)： | 10/13頁(yè) |
| 文件大?。?/td> | 621K |
| 描述： | IC IR LIGHT-VOLT CONV SMD SIDELK |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | * |
| 其它名稱(chēng)： | TSL260-RSM-LFDKR TSL260-RSM-LFDKR-ND TSL260RSM-LFDKR |
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TSL250RD, TSL251RD, TSL260RD, TSL261RD
LIGHT-TO-VOLTAGE OPTICAL SENSORS
TAOS050K OCTOBER 2007
9
The LUMENOLOGY r Company
r
r
Copyright E 2007, TAOS Inc.
www.taosinc.com
MANUFACTURING INFORMATION
The Plastic Small Outline IC package (D) has been tested and has demonstrated an ability to be reflow soldered
to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The component should
be limited to a maximum of three passes through this solder reflow profile.
Table 1. TSL2xxRD Solder Reflow Profile
PARAMETER
REFERENCE
TSL2xxRD
Average temperature gradient in preheating
2.5癈/sec
Soak time
t
soak
2 to 3 minutes
Time above 217癈
t
1
Max 60 sec
Time above 230癈
t
2
Max 50 sec
Time above T
peak
10?/SPAN>C
t
3
Max 10 sec
Peak temperature in reflow
T
peak
260?C (0癈/+5癈)
Temperature gradient in cooling
Max 5癈/sec
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale for reference only
Time (sec)
Figure 12. TSL2xxRD Solder Reflow Profile Graph
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TSL261 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| TSL261R | 制造商:TAOS Inc 功能描述:SENSOR L/VOLTS BLK PKG |
| TSL261RD | 功能描述:光頻率和光電壓 Light to Voltage Converter RoHS:否 制造商:ams 峰值波長(zhǎng):1000 nm 工作電源電壓:5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 安裝風(fēng)格: 封裝 / 箱體: |
| TSL261RD-TR | 功能描述:光頻率和光電壓 Light to Voltage Converter RoHS:否 制造商:ams 峰值波長(zhǎng):1000 nm 工作電源電壓:5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 安裝風(fēng)格: 封裝 / 箱體: |
| TSL261R-LF | 功能描述:光頻率和光電壓 Light to Voltage NIR RoHS:否 制造商:ams 峰值波長(zhǎng):1000 nm 工作電源電壓:5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 安裝風(fēng)格: 封裝 / 箱體: |
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