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參數(shù)資料
| 型號(hào)： | TSL2561CS |
| 廠商： | TAOS Inc. |
| 英文描述： | LIGHT-TO-DIGITAL CONVERTER |
| 中文描述： | 光到數(shù)字轉(zhuǎn)換器 |
| 文件頁(yè)數(shù)： | 35/38頁(yè) |
| 文件大?。?/td> | 441K |
| 代理商： | TSL2561CS |
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TSL2560, TSL2561
LIGHT-TO-DIGITAL CONVERTER
TAOS059K
APRIL 2007
35
The
LUMENOLOGY
Company
Copyright 2007, TAOS Inc.
www.taosinc.com
MANUFACTURING INFORMATION
Tooling Required
Chipscale
Solder stencil (square aperture size 0.210 mm, stencil thickness of 152
μ
m)
TMB
Solder stencil (aperture size 0.70 mm x 0.90 mm, stencil thickness of 152
μ
m)
Process
1.
Apply solder paste using stencil
2.
Place component
3.
Reflow solder/cure
4.
X-Ray verify (recommended for chipscale only)
Additional Notes for Chipscale
Placement of the TSL2560/TSL2561 chipscale device onto the gold immersion substrate is accomplished using
a standard surface mount manufacturing process. Using a 152-
μ
m stencil with a 0.21 mm square aperture, print
solder paste onto the substrate. Machine-place the TSL2560/TSL2561 from the tape onto the substrate. A
suggest pick-up tool is the Siemens Vacuum Pickup tool nozzle number 912. This nozzle has a rubber tip with
a diameter of approximately 0.75 mm. The part is picked up from the center of the body.
It is important to use a substrate that has an immersion plating surface. This may be immersion gold, solder,
or white tin. Hot air solder leveled (HASL) substrates are not coplanar, making them difficult to work with.
Qualified Equipment
EKRA E5 — Stencil Printer
ASYMTEC Century — Dispensing system
SIEMENS F5 — Placement system
SIEMENS 912 — Vacuum Pickup Tool Nozzle
VITRONICS 820 — Oven
PHOENIX — Inspector X-Ray system
Qualified Materials
Microbond solder paste, part number NC421
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TSL2561T | LIGHT-TO-DIGITAL CONVERTER |
| TSL2562 | LOW-VOLTAGE LIGHT-TO-DIGITAL CONVERTER |
| TSL2562CS | LOW-VOLTAGE LIGHT-TO-DIGITAL CONVERTER |
| TSL2562T | LOW-VOLTAGE LIGHT-TO-DIGITAL CONVERTER |
| TSL2563 | LOW-VOLTAGE LIGHT-TO-DIGITAL CONVERTER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TSL2561FN | 功能描述:光學(xué)數(shù)位轉(zhuǎn)換器 Light to Digital Sensor RoHS:否 制造商:ams 數(shù)據(jù)總線寬度: 峰值波長(zhǎng):470 nm 最大工作頻率: 工作電源電壓: 工作電流: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:Chipscale-6 封裝:Reel |
| TSL2561T | 功能描述:光學(xué)數(shù)位轉(zhuǎn)換器 Light to Digital with I2C RoHS:否 制造商:ams 數(shù)據(jù)總線寬度: 峰值波長(zhǎng):470 nm 最大工作頻率: 工作電源電壓: 工作電流: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:Chipscale-6 封裝:Reel |
| TSL2562 | 制造商:TAOS 制造商全稱(chēng):TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS 功能描述:LOW-VOLTAGE LIGHT-TO-DIGITAL CONVERTER |
| TSL2562CL | 功能描述:光學(xué)數(shù)位轉(zhuǎn)換器 Ambient Light Sensor SMBus RoHS:否 制造商:ams 數(shù)據(jù)總線寬度: 峰值波長(zhǎng):470 nm 最大工作頻率: 工作電源電壓: 工作電流: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:Chipscale-6 封裝:Reel |
| TSL2562CS | 功能描述:接口 - 專(zhuān)用 Ambient Light Sensor Light to Digital RoHS:否 制造商:Texas Instruments 產(chǎn)品類(lèi)型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:BGA-59 |
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