參數(shù)資料
型號(hào)： TS68C429AVF
廠商： ATMEL CORP
元件分類： 微控制器/微處理器
英文描述： CMOS ARINC 429 Multichannel Receiver/ Transmitter MRT
中文描述： 3 CHANNEL(S), 2.5M bps, SERIAL COMM CONTROLLER, CQFP132
封裝： CERAMIC, QFP-132
文件頁(yè)數(shù)： 9/43頁(yè)
文件大?。?/td> 1638K
代理商： TS68C429AVF
9
TS68C429A
2120A–HIREL–08/02
Power Considerations
The average chip-junction temperature, T
J
, in
°
C can be obtained from:
T
J
= T
A
+ (P
D
θ
JA
)
T
A
= Ambient Temperature,
°
C
θ
JA
= Package Thermal Resistance, Junction-to-Ambient,
°
C/W
P
D
= P
INT
+ P
I/O
P
INT
= I
CC
x V
CC
, Watts—Chip Internal Power
P
I/O
= Power Dissipation on Input and Output Pins—User Determined
For most applications P
I/O
< P
INT
and can be neglected.
An approximate relationship between P
D
and T
J
(if P
I/O
is neglected) is:
P
D
= K: (T
J
+ 273)
Solving equations (1) and (2) for K gives:
K = P
D
(T
A
+ 273) +
θ
JA
P
D
where K is a constant pertaining to the particular part K can be determined from equa-
tion (3) by measuring P
D
(at equilibrium) for a known T
A
. Using this value of K, the
values of P
D
and T
J
can be obtained by solving equations (1) and (2) iteratively for any
value of T
A
.
The total thermal resistance of a package (
θ
JA
) can be separated into two components,
θ
JC
and
θ
CA
, representing the barrier to heat flow from the semiconductor junction to the
package (case), surface (
θ
JC
) and from the case to the outside ambient (
θ
CA
). These
terms are related by the equation:
θ
JA
=
θ
JC
+
θ
CA
θ
JC
is device related and cannot be influenced by the user. However,
θ
CA
is user depen-
dent and can be minimized by such thermal management techniques as heat sinks,
ambient air cooling and thermal convection. Thus, good thermal management on the
part of the user can significantly reduce
θ
CA
so that
θ
JA
approximately equals
θ
JC
. Substi-
tution of
θ
JC
for
θ
JA
in equation (1) will result in a lower semiconductor junction
temperature.
(1)
(2)
2
(3)
(4)
Mechanical and
Environment
The microcircuits shall meet all mechanical environmental requirements of either MIL-
STD-883 for class B devices or DESC devices.
Marking
The document where are defined the marking are identified in the related reference doc-
uments. Each microcircuit are legibly and permanently marked with the following
information as minimum:
Atmel logo
Manufacturer’s part number
Class B identification
Date-code of inspection lot
ESD identifier if available
Country of manufacturing
相關(guān)PDF資料
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TS68C429AVF1 功能描述:IC MULTI-CH CTRLR 132CQFP RoHS:否 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A
TS68C429AVF1A 制造商:e2v technologies 功能描述:TS68C429AVF1A - Trays
TS68C429AVF1B/C 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:CMOS ARINC 429 Multichannel Receiver/ Transmitter MRT
TS68C429AVFA 制造商:e2v technologies 功能描述:MULTI CH RCVR/TRANSMITTER 132CQFP - Trays
TS68C429AVR 功能描述:IC MULTI-CH CTRLR 84PGA RoHS:否 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A
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