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參數(shù)資料
| 型號： | TS4405P |
| 廠商： | Taiwan Semiconductor Co., Ltd. |
| 英文描述： | Single P-Channel 1.8V Specified MicroSURF⑩ |
| 中文描述： | 單P通道1.8V的指定MicroSURF⑩ |
| 文件頁數(shù)： | 1/3頁 |
| 文件大?。?/td> | 154K |
| 代理商： | TS4405P |
TS4405P - Single P-Channel 1.8V Specified MicroSURF
General Description
Taiwan Semiconductor’s new low cost,
state of the art MicroSURF lateral
MOSFET process technology in chipscale
bondwireless packaging minimizes PCB
space and R
DS(ON)
plus provides an ultra-
low Qg X R
DS(ON)
figure of merit.
Absolute Maximum Ratings
T
A
=25°C unless otherwise noted
Symbol Parameter
V
DSS
Drain-Source Voltage
V
GSS
Gate-Source Voltage
I
D
Drain Current
– Continuous
– Pulsed
P
D
Power Dissipation (Steady State)
T
J
, T
STG
Operating and Storage Junction Temperature Range
Ratings
-12
+8
-4.9
-10
1.5
-55 to +150
Units
V
V
A
W
oC
Thermal Characteristics
R
θ
JA
Thermal Resistance, Junction-to-Ambient
R
θ
JR
Thermal Resistance, Junction-to-Ball
R
θ
JC
Thermal Resistance, Junction-to-Case
85
20
1.8
°C/W
MicroSURF for Load Switching
and PA Switch
Patent Pending
Features
-4.9A, -12V
R
DS(ON)
=
50m
at -4.5 Volts
-4.4A, -12V
R
DS(ON)
=
70m
at -2.5 Volts
-4.0A, -12V R
DS(ON)
= 90m
at -1.8 Volts
Low profile package: less than 0.8mm height
when mounted on PCB.
Occupies only 1.21 mm
2
of PCB area.
Less than 30% of the area of a SC-70.
Excellent thermal characteristics.
Lead free solder bumps available.
PRELIMINARY DATA SHEET
For information only
1
6/8/03 Rev0
Bump Side View
S
S
G
D
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