參數(shù)資料
型號(hào)： TRCV012G53XE1
元件分類： 運(yùn)動(dòng)控制電子
英文描述： TRCV012G5 (2.5 Gbits/s) and TRCV012G7 (2.5 Gbits/s and 2.7 Gbits/s) Limiting Amplifier, Clock Recovery, 1:16 Data Demultiplexer
中文描述： TRCV012G5（2.5 Gb /秒）和TRCV012G7（2.5 Gb /秒和2.7 Gb /秒）限幅放大器，時(shí)鐘恢復(fù)，1:16數(shù)據(jù)復(fù)用器
文件頁(yè)數(shù)： 26/28頁(yè)
文件大?。?/td> 500K
代理商： TRCV012G53XE1
TRCV012G5 and TRCV012G7
Limiting Amplifier, Clock Recovery, 1:16 Data Demultiplexer
Preliminary Data Sheet
August 2000
26
Lucent Technologies Inc.
Outline Diagram
(continued)
Board Installation Recommendations
5-9862 (F)r.1
Figure 12. Heat Sink Ground Pattern
Thermal Considerations (MBIC 025 BiCMOS and MBIC 025 SiGe BiCMOS)
The TRCV012G5 and TRCV012G7 devices use a square heat sink on the bottom of the package for heat dissipa-
tion. This heat sink is planar with the lead surface which contacts the board. For optimum heat transfer, the heat
sink should be soldered to the application board using the suggested footprint shown above. Depending on the
application more heat sinking may be required.
Note:
Certain precautions must be taken when using solder. For installation using a constant temperature solder,
temperatures of under 300 °C may be employed for periods of time up to 5 seconds, maximum. For installa-
tion with a soldering iron (battery operated or non-switching only), the soldering tip temperature should not
be greater than 300 °C and the soldering time for each lead must not exceed 5 seconds.
Table 19. Thermal Resistance
Parameter
Symbol
Conditions
Unit
(°C/W)
11.5
18
15.6
14.6
Thermal resistance, junction to board
Thermal resistance, junction to
ambient
θ
JB
θ
JA
No air flow, device soldered to board
100 lfpm, device soldered to board
300 lfpm, device soldered to board
500 lfpm, device soldered to board
0.705
0.193
0.100
0.012
0.060
0.100
0.311
0.941
0.320
0.050
0.160
0.160
0.270
0.270
0.050
HEAT SINK
GROUND
PATTERN
TYP
0.032
0.320
0.019685
相關(guān)PDF資料
PDF描述
TRCV012G73XE1 TRCV012G5 (2.5 Gbits/s) and TRCV012G7 (2.5 Gbits/s and 2.7 Gbits/s) Limiting Amplifier, Clock Recovery, 1:16 Data Demultiplexer
TRCV012G5 TRCV012G5 (2.5 Gbits/s) and TRCV012G7 (2.5 Gbits/s and 2.7 Gbits/s) Limiting Amplifier, Clock Recovery, 1:16 Data Demultiplexer
TRCV012G7 TRCV012G5 (2.5 Gbits/s) and TRCV012G7 (2.5 Gbits/s and 2.7 Gbits/s) Limiting Amplifier, Clock Recovery, 1:16 Data Demultiplexer
TRCV012G5 Limiting Amplifier, Clock Recovery, 1:16 Data Demultiplexer(2.5 Gbits/s)(限幅放大器，時(shí)鐘恢復(fù)，1：16數(shù)據(jù)多路分解器(2.5 G位/秒))
TRCV012G7 Limiting Amplifier, Clock Recovery, 1:16 Data Demultiplexer(2.5 Gbits/s and 2.7 Gbits/s)(限幅放大器，時(shí)鐘恢復(fù)，1：16數(shù)據(jù)多路分解器(2.5 G位/秒和 2.7 G位/秒))
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TRCV012G7 制造商:AGERE 制造商全稱:AGERE 功能描述:TRCV012G5 (2.5 Gbits/s) and TRCV012G7 (2.5 Gbits/s and 2.7 Gbits/s) Limiting Amplifier, Clock Recovery, 1:16 Data Demultiplexer
TRCV012G73XE1 制造商:AGERE 制造商全稱:AGERE 功能描述:TRCV012G5 (2.5 Gbits/s) and TRCV012G7 (2.5 Gbits/s and 2.7 Gbits/s) Limiting Amplifier, Clock Recovery, 1:16 Data Demultiplexer
TRD10-103 制造商:RCD 制造商全稱:RCD COMPONENTS INC. 功能描述:RADIAL LEAD TANGOLDTM CAPACITORS EPOXY RESIN COATED, TANTALUM
TRD10-104 制造商:RCD 制造商全稱:RCD COMPONENTS INC. 功能描述:RADIAL LEAD TANGOLDTM CAPACITORS EPOXY RESIN COATED, TANTALUM
TRD10-105 制造商:RCD 制造商全稱:RCD COMPONENTS INC. 功能描述:RADIAL LEAD TANGOLDTM CAPACITORS EPOXY RESIN COATED, TANTALUM
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