參數(shù)資料
型號(hào): TPS79428DGNR
廠商: Texas Instruments, Inc.
英文描述: ULTRALOW-NOISE, HIGH PSRR, FAST RF 250-mA LOW-DROPOUT LINEAR REGULATORS
中文描述: 超低噪聲,高PSRR,快速射頻250毫安低壓降線性穩(wěn)壓器
文件頁(yè)數(shù): 10/15頁(yè)
文件大?。?/td> 487K
代理商: TPS79428DGNR
www.ti.com
Board Layout Recommendation to Improve PSRR and Noise Performance
To improve ac measurements like PSRR, output noise, and transient response, it is recommended that the board
be designed with separate ground planes for V
and V
, with each ground plane connected only at the ground
pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the
ground pin of the device.
PCB Copper Area in
100
80
40
0
1
2
3
T
120
140
THERMAL RESISTANCE
vs
PCB COPPER AREA
180
4
5
160
60
0
20
J
θ
C
°
)
Surface-Mount Package
1 oz. Copper
CIRCUIT BOARD COPPER AREA
SOT223 Surface-Mount Package
Power and Dissipation and Junction Temperature
Specified regulator operation is assured to a junction temperature of 125
°
C; the maximum junction temperature
should be restricted to 125
°
C under normal operating conditions. This restriction limits the power dissipation the
regulator can handle in any given application. To ensure the junction temperature is within acceptable limits,
calculate the maximum allowable dissipation, P
D(max)
, and the actual dissipation, P
D
, which must be less than or
equal to P
D(max)
.
The maximum-power-dissipation limit is determined using the following equation:
PD(max)
TJmax
TA
R
θ
JA
(1)
PD
VIN
VOUT
IOUT
(2)
Regulator Mounting
The tab of the SOT223-6 package is electrically connected to ground. For best thermal performance, the tab of
the surface-mount version should be soldered directly to a circuit-board copper area. Increasing the copper area
improves heat dissipation. Solder pad footprint recommendations for the devices are presented in an application
bulletin
Solder Pad Recommendations for Surface-Mount Devices
, literature number AB-132, available from the
TI web site (www.ti.com).
TPS79401, TPS79418
TPS79425, TPS79428
TPS79430, TPS79433
SLVS349D–NOVEMBER 2001–REVISED OCTOBER 2004
Figure 23. Thermal Resistance vs PCB Area for the SOT223-6.
where:
T
J
max is the maximum allowable junction temperature.
R
θ
JA
is the thermal resistence juntion-to-ambient for the package. See the power dissipation table and
Figure 1
T
A
is the ambient temperature.
The regulator dissipation is calculated using:
Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal
protection circuit.
10
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