參數(shù)資料
型號: TPS77525PWPRG4
廠商: Texas Instruments, Inc.
元件分類: 基準(zhǔn)電壓源/電流源
英文描述: FAST-TRANSIENT-RESPONSE 500mA LOW-DROPOUT VOLTAGE REGULATORS
中文描述: 快速瞬態(tài)響應(yīng)500mA的低壓差電壓調(diào)節(jié)器
文件頁數(shù): 2/28頁
文件大小: 791K
代理商: TPS77525PWPRG4
www.ti.com
ABSOLUTE MAXIMUM RATINGS
Over operating temperature range (unless otherwise noted)
(1)
DISSIPATION RATINGS
TPS775xx, TPS776xx
SLVS232I–SEPTEMBER 1999–REVISED AUGUST 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION
(1)
PRODUCT
V
OUT(2)
TPS775
xx
yyyz
, TPS776
xx
yyyz
XX
is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable).
YYY
is package designator.
Z
is package quantity.
(1)
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
website at
www.ti.com
.
Custom fixed output voltages are available; minimum order quantities may apply. Contact factory for details and availability.
(2)
PARAMETER
Input voltage range, V
IN(2)
Voltage range at EN
Maximum RESET voltage (TPS775xx)
Maximum PG voltage (TPS776xx)
Peak output current
Voltage range at OUT, FB
Continuous total power dissipation
Operating junction temperature range, T
J
Storage junction temperature range , T
STG
ESD rating, HBM
TPS775xx, TPS776xx
–0.3 to +13.5
–0.3 to +16.5
16.5
16.5
Internally limited
7
See
Dissipation Ratings Table
–40 to +125
–65 to +150
2
UNIT
V
V
V
V
V
°
C
°
C
kV
(1)
Stresses above these ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended
periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other
conditions beyond those specified is not implied.
All voltages are with respect to network terminal ground.
(2)
AIRFLOW
(CFM)
0
250
0
300
0
300
DERATING FACTOR
ABOVE T
A
= +25
°
C
5.68mW/
°
C
9.04mW/
°
C
23.5mW/
°
C
34.6mW/
°
C
23.8mW/
°
C
57.9mW/
°
C
BOARD
PACKAGE
T
A
< +25
°
C
568mW
904mW
2.9mW
4.3mW
3W
7.2W
T
A
= +70
°
C
312mW
497mW
1.9W
2.8W
1.9W
4.6W
T
A
= +85
°
C
227mW
361mW
1.5W
2.2W
1.5W
3.8W
D
Low-K
(1)
PWP
High-K
(2)
PWP
(1)
This parameter is measured with the recommended copper heat sink pattern on a 1-layer, 5in
5in printed circuit board (PCB), 1-ounce
copper, 2in
2in coverage (4in
2
).
This parameter is measured with the recommended copper heat sink pattern on a 8-layer, 1.5in
2in PCB, 1-ounce copper with layers 1,
2, 4, 5, 7, and 8 at 5% coverage (0.9in
2
) and layers 3 and 6 at 100% coverage (6in
2
). For more information, refer to TI technical brief
SLMA002
.
(2)
2
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