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參數(shù)資料
| 型號： | TPS75615KTTR |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | FAST-TRANSIENT RESPONSE 5-A LOW-DROPOUT VOLTAGE REGULATORS |
| 中文描述： | 快速瞬態(tài)響應(yīng)5 -低壓差電壓調(diào)節(jié)器 |
| 文件頁數(shù)： | 12/24頁 |
| 文件大?。?/td> | 450K |
| 代理商： | TPS75615KTTR |
www.ti.com
THERMAL INFORMATION
PDmax
VI(avg)
VO(avg)
IO(avg)
VI(avg)x I(Q)
(1)
A
B
C
A
B
C
T
J
A
R
θ
JC
T
C
B
R
θ
CS
T
A
C
R
θ
SA
(a)
(b)
TO–263 Package
TO–220 Package
TPS75601, TPS75615
TPS75618, TPS75625
TPS75633
SLVS329C–JUNE 2001–REVISED MARCH 2004
The amount of heat that an LDO linear regulator generates is directly proportional to the amount of power it
dissipates during operation. All integrated circuits have a maximum allowable junction temperature (T
J
max)
above which normal operation is not assured. A system designer must design the operating environment so that
the operating junction temperature (T
J
) does not exceed the maximum junction temperature (T
J
max). The two
main environmental variables that a designer can use to improve thermal performance are air flow and external
heatsinks. The purpose of this information is to aid the designer in determining the proper operating environment
for a linear regulator that is operating at a specific power level.
In general, the maximum expected power (P
D(max)
) consumed by a linear regulator is computed as:
Where:
V
I(avg)
is the average input voltage.
V
O(avg)
is the average output voltage.
I
O(avg)
is the average output current.
I
(Q)
is the quiescent current.
For most TI LDO regulators, the quiescent current is insignificant compared to the average output current;
therefore, the term V
I(avg)
x I
(Q)
can be neglected. The operating junction temperature is computed by adding the
ambient temperature (T
A
) and the increase in temperature due to the regulator's power dissipation. The
temperature rise is computed by multiplying the maximum expected power dissipation by the sum of the thermal
resistances between the junction and the case (R
Θ
JC
), the case to heatsink (R
Θ
CS
), and the heatsink to ambient
(R
Θ
SA
). Thermal resistances are measures of how effectively an object dissipates heat. Typically, the larger the
device, the more surface area available for power dissipation and the lower the object's thermal resistance.
Figure 21 illustrates these thermal resistances for (a) a TO-220 package attached to a heatsink, and (b) a
TO-263 package mounted on a JEDEC High-K board.
Figure 21. Thermal Resistances
12
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TPS75615KTTRG3 | 功能描述:低壓差穩(wěn)壓器 - LDO 5-A 1.5-V LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS75615KTTT | 功能描述:低壓差穩(wěn)壓器 - LDO 5-A 1.5-V LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS75615KTTTG3 | 功能描述:低壓差穩(wěn)壓器 - LDO 5-A 1.5-V LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS75618KC | 功能描述:低壓差穩(wěn)壓器 - LDO 5-A 1.8-V LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS75618KCG3 | 功能描述:低壓差穩(wěn)壓器 - LDO 5-A 1.8-V LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
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